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<p>The effect of variation in Ni percentage on the mechanical properties of polycrystalline nanostructured thin films of Cu-Ni alloy was analyzed by molecular dynamics (MD) simulations and pulsed electrodeposition (PED) experiments. Nanoindentation simulations using embedded atom method (EAM) potential were carried out with varying Ni percentage. Load-vs.-displacement plots were generated by MD simulations and the values of hardness and Young's modulus were calculated from the plots. The highest values of hardness and Young's modulus were achieved at nanostructured Cu-Ni alloy containing 40 wt.% and 50 wt.% of Ni, respectively, as revealed by MD simulations. These results were validated by preparing uniform thin films of Cu-Ni alloy over a mild steel substrate by the process of PED. X-ray diffraction (XRD) results and high-resolution transmission electron microscopic (HRTEM) studies confirmed the presence of FCC structure and grain size was found to be near 10&#xa0;nm. Scanning electron microscopy (SEM), atomic force microscopy (AFM) and energy-dispersive x-ray spectroscopy (EDX) were done to analyze the film thickness, surface morphology, roughness and stoichiometry. Nanoindentation test results revealed that hardness and Young's modulus values are in good agreement with simulation results. Potentiodynamic polarization tests were conducted which assured an unaltered corrosion resistance even after the enhancements in mechanical properties. Further, erosion–corrosion test was also carried out and results were found to be promising. This investigation lays out useful guidelines for designing and developing a potent nanostructured Cu-Ni alloy thin film for advanced applications in marine and naval structures.</p>

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Elucidating Enhancement of the Properties of Nanostructured Cu-Ni Alloy Thin Film for Marine Structures by Molecular Dynamics Simulations and Pulsed Electrodeposition

  • 期刊论文

  • 发表日期：

    2025年9月25日

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  • Hrishikesh Kumar,
  • Satadipa Banerjee,
  • Manoj Warrier,
  • Aaditya Majalee,
  • Pakanati Siva Prasad,
  • Pritam Sadhukhan,
  • Ajay Kumar Mishra,
  • K. S. Ghosh,
  • S. Pramanik,
  • M. M. Ghosh

摘要

The effect of variation in Ni percentage on the mechanical properties of polycrystalline nanostructured thin films of Cu-Ni alloy was analyzed by molecular dynamics (MD) simulations and pulsed electrodeposition (PED) experiments. Nanoindentation simulations using embedded atom method (EAM) potential were carried out with varying Ni percentage. Load-vs.-displacement plots were generated by MD simulations and the values of hardness and Young's modulus were calculated from the plots. The highest values of hardness and Young's modulus were achieved at nanostructured Cu-Ni alloy containing 40 wt.% and 50 wt.% of Ni, respectively, as revealed by MD simulations. These results were validated by preparing uniform thin films of Cu-Ni alloy over a mild steel substrate by the process of PED. X-ray diffraction (XRD) results and high-resolution transmission electron microscopic (HRTEM) studies confirmed the presence of FCC structure and grain size was found to be near 10 nm. Scanning electron microscopy (SEM), atomic force microscopy (AFM) and energy-dispersive x-ray spectroscopy (EDX) were done to analyze the film thickness, surface morphology, roughness and stoichiometry. Nanoindentation test results revealed that hardness and Young's modulus values are in good agreement with simulation results. Potentiodynamic polarization tests were conducted which assured an unaltered corrosion resistance even after the enhancements in mechanical properties. Further, erosion–corrosion test was also carried out and results were found to be promising. This investigation lays out useful guidelines for designing and developing a potent nanostructured Cu-Ni alloy thin film for advanced applications in marine and naval structures.