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<p>In this work, the spreading behavior of a Zn solder droplet on TC4 sheet with the help of ultrasonic was studied. Results show that the solder spreads rapidly with the help of ultrasonic due to the high acoustic pressure formed in the droplet center. The spreading center shows complete wetting, while the near-center-region shows spot wetting when using short ultrasonic time. Prolonging the ultrasonic action time contributes the interaction of Zn and Ti at the spreading center, forming intermetallic compound (IMC). The oxide layer remains intact at the spreading front when changing ultrasonic times. Thick IMCs with cracks form when using ultrasonic time longer than 5 s. TC4 substrate and TiZn<sub>3</sub> have similar hardness, TiZn<sub>3</sub> and TiZn IMC have similar modulus.</p>

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Ultrasonic-Induced Rapid Spreading of Zn Droplet on TC4 Substrate and Zn/Ti Interaction at the Bonding Interface

  • 期刊论文

  • 发表日期：

    2025年9月16日

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  • Tao Li,
  • Yuanbiao Cui,
  • Wancun Liu,
  • Yuding Liu,
  • Zhengwei Li,
  • Zhiwu Xu,
  • Jiuchun Yan

摘要

In this work, the spreading behavior of a Zn solder droplet on TC4 sheet with the help of ultrasonic was studied. Results show that the solder spreads rapidly with the help of ultrasonic due to the high acoustic pressure formed in the droplet center. The spreading center shows complete wetting, while the near-center-region shows spot wetting when using short ultrasonic time. Prolonging the ultrasonic action time contributes the interaction of Zn and Ti at the spreading center, forming intermetallic compound (IMC). The oxide layer remains intact at the spreading front when changing ultrasonic times. Thick IMCs with cracks form when using ultrasonic time longer than 5 s. TC4 substrate and TiZn3 have similar hardness, TiZn3 and TiZn IMC have similar modulus.