Analysis of the Oxidation Process in Textured Cu-Ni-Me (Me = Ta, W) Substrates by EDS and Raman Methods
摘要
In this work, the high-temperature oxidation behavior of copper-nickel-based ternary alloys with additives of refractory metals (W and Ta) was investigated using a thermogravimetric analysis. It was observed that textured tapes of studied ternary alloys have a higher oxidation resistance at the deposition temperature of functional layers, i.e., at 700 °C, compared to pure copper tapes. The chemical composition and pattern of distribution of the formed oxides were determined through electron microscopic and Raman studies of the oxidized surface of textured samples after a series of short-term annealing. The findings indicate that oxidation of the surface of (Cu + Ni)-Ta and (Cu + Ni)-W alloys initially occurs homogeneously with the formation of Cu2O film. As a result of prolonged corrosion process, a transformation from copper (I) oxide (Cu2O) to copper (II) oxide (CuO) undergoes in the oxide film of the investigated ternary alloys.