Experimental Investigation of CuO Nanofluid Minimum Quantity Lubrication Grinding Process
摘要
The lubricating and cooling performance is important role in the reduction of high temperature in the cutting zone. The nanofluid significantly improves the heat transfer capacity and lubricating performance of the base fluid. In the present work, the lubricating and grinding performance of water-based copper oxide (CuO) nanofluid under minimum quantity lubrication (MQL) for AISI D3 material grinding was evaluated under different conditions of lubrication. The macro- and micro-evaluation parameters were considered for finding the lubricating performance of nanofluid at the wheel/workpiece contact interface. The experimental finding shows improvement of surface grinding process by CuO nanofluid using 0.2 volume% concentrations under MQL. The coefficient of friction is reduced by 29.94%, tangential force by 22.22%, temperature at the wheel/workpiece contact interface by 17.42%, surface roughness by 15.69%, and specific energy by 23.41% compared to MQL grinding. The scanning electron microscope images of debris and workpiece surfaces confirmed the lubricating effect of nanofluid and the efficiency of the nanofluid MQL process. Moreover, nanofluid MQL serves the purpose of environment-friendly machining and to produce economical quality production using small quantity of nanofluid.