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<p>Silicon carbide (SiC) ceramics have high hardness, high thermal conductivity, low coefficient of thermal expansion, high-temperature resistance, corrosion resistance and other properties. They are often manufactured as engine valves and nozzles, thermal insulation tiles of spacecraft, heat exchangers in chemical and energy industries and are widely used in automotive manufacturing, aerospace, semiconductor and other fields. However, the traditional turning, milling and other machining methods used to process SiC ceramics are prone to micro cracks, edge breakage and other problems in the machining process. In order to achieve high-quality machining, a method of precision milling and grinding with ultrasonic assistance is proposed. Firstly, the ultrasonic-assisted grinding (UAG) is studied by modeling and simulation, and the optimization effect of ultrasonic vibration on grinding force and surface roughness is verified. Then, the influence of key machining parameters on milling quality is studied by single factor experiment. The experimental results show that the machining effect is optimal when the amplitude is 4&#xa0;μm. Further Box-Behnken experiments were conducted to analyze the interaction between different parameters, so as to obtain the optimal combination of machining parameters. Finally, the SiC heat sink with a surface roughness of 98&#xa0;nm was machined by using the optimized parameters. The high-quality and stable machining of the typical structure shows the application potential of UAG technology in the machining of hard and brittle materials.</p>

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Improvement of Grinding Force and Surface Roughness in Ultrasonic-Assisted Precision Mill Grinding of Sintered Silicon Carbide

  • 期刊论文

  • 发表日期：

    2025年5月6日

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  • Jiale Wang,
  • Yong Liu,
  • Chenghu Jia,
  • Haichao Xu,
  • Kan Wang

摘要

Silicon carbide (SiC) ceramics have high hardness, high thermal conductivity, low coefficient of thermal expansion, high-temperature resistance, corrosion resistance and other properties. They are often manufactured as engine valves and nozzles, thermal insulation tiles of spacecraft, heat exchangers in chemical and energy industries and are widely used in automotive manufacturing, aerospace, semiconductor and other fields. However, the traditional turning, milling and other machining methods used to process SiC ceramics are prone to micro cracks, edge breakage and other problems in the machining process. In order to achieve high-quality machining, a method of precision milling and grinding with ultrasonic assistance is proposed. Firstly, the ultrasonic-assisted grinding (UAG) is studied by modeling and simulation, and the optimization effect of ultrasonic vibration on grinding force and surface roughness is verified. Then, the influence of key machining parameters on milling quality is studied by single factor experiment. The experimental results show that the machining effect is optimal when the amplitude is 4 μm. Further Box-Behnken experiments were conducted to analyze the interaction between different parameters, so as to obtain the optimal combination of machining parameters. Finally, the SiC heat sink with a surface roughness of 98 nm was machined by using the optimized parameters. The high-quality and stable machining of the typical structure shows the application potential of UAG technology in the machining of hard and brittle materials.