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<p>The present study investigates the microstructural stability during powder forging of Al-Cu alloys with stabilizers (1%Zr, 1%Nb, and 1%Y), their mechanical properties, and strengthening mechanisms for high strength with low weight applications. The powder forging was carried out for the ball-milled Al4.5%Cu, Al4.5%Cu1%Zr, Al4.5%Cu1%Nb, and Al4.5%Cu1%Y alloys at 350, 450, and 550&#xa0;°C. The microstructural investigation through TEM analysis confirmed that average grain size was within the nanometer range that is less than 100&#xa0;nm, and corresponding excellent densification due to diffusion bonding is found to be 96%, 97%, and 97%, respectively, for all three samples, when the forging was carried out at 550&#xa0;°C. The yield strength (YS) and ultimate tensile strength (UTS) of all alloys (i.e., Al4.5%Cu, Al4.5%Cu1%Zr, Al4.5%Cu1%Nb, and Al4.5%Cu1%Y) powder forged at 550&#xa0;°C is considerably higher than that of the alloys forged at 350&#xa0;°C and 450&#xa0;°C. This is due to the fact that more amounts of Zr, Nb, and Y dissolved in the matrix lead to obstructed motion of the grain boundaries. These mechanical properties (YS and UTS) can also be improved due to proper solid solution by alloying, grain size reduced from coarser to ultrafine grain or nanograin (i.e., less than 100&#xa0;nm), and accumulation of dislocations during powder forging. The presence of fine dimples with uniform distribution at high-temperature forging could lead to retain the strength and ductility at high temperature as compared to low-temperature forging.</p>

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Effect of Insoluble Elements on the Microstructural and Mechanical Properties of Light Al-Cu Alloy Produced by Powder Forging for High Strength Applications

  • 期刊论文

  • 发表日期：

    2025年4月14日

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  • Vishwanath Lande,
  • S. M. Dasharath,
  • S. M. Jagadeesh Babu

摘要

The present study investigates the microstructural stability during powder forging of Al-Cu alloys with stabilizers (1%Zr, 1%Nb, and 1%Y), their mechanical properties, and strengthening mechanisms for high strength with low weight applications. The powder forging was carried out for the ball-milled Al4.5%Cu, Al4.5%Cu1%Zr, Al4.5%Cu1%Nb, and Al4.5%Cu1%Y alloys at 350, 450, and 550 °C. The microstructural investigation through TEM analysis confirmed that average grain size was within the nanometer range that is less than 100 nm, and corresponding excellent densification due to diffusion bonding is found to be 96%, 97%, and 97%, respectively, for all three samples, when the forging was carried out at 550 °C. The yield strength (YS) and ultimate tensile strength (UTS) of all alloys (i.e., Al4.5%Cu, Al4.5%Cu1%Zr, Al4.5%Cu1%Nb, and Al4.5%Cu1%Y) powder forged at 550 °C is considerably higher than that of the alloys forged at 350 °C and 450 °C. This is due to the fact that more amounts of Zr, Nb, and Y dissolved in the matrix lead to obstructed motion of the grain boundaries. These mechanical properties (YS and UTS) can also be improved due to proper solid solution by alloying, grain size reduced from coarser to ultrafine grain or nanograin (i.e., less than 100 nm), and accumulation of dislocations during powder forging. The presence of fine dimples with uniform distribution at high-temperature forging could lead to retain the strength and ductility at high temperature as compared to low-temperature forging.