Scholarlink

<p>The potential of the transient liquid phase (TLP) process to obtain appropriate bonding between AISI 304 L stainless steel and copper was evaluated via two different interlayers of indium and tin. For this purpose, TLP bonding was performed at 650&#xa0;°C and 700&#xa0;°C using indium and tin interlayers, respectively, for two different times of 10 and 20&#xa0;minutes. To overcome the wettability barrier of stainless steel due to its oxide layer, tin and indium pre-soldered onto the surface of stainless steel, which not only overcomes the low wettability of stainless steel but also makes it possible to perform TLP bonding in an air atmosphere. When the bonding time was increased to 10 and then 20 minutes, due to isothermal solidification, a δ-free microstructure of the Cu(Sn) and Cu(In) solid solutions with a rather homogeneous composition and hardness and maximum shear strengths of 162 and 173&#xa0;MPa, respectively, formed in the joint areas. In addition, the joints not only exhibit a ductile dimple mode of fracture but also increase the remelting temperature of the formed (Cu) solid solutions to approximately 1000&#xa0;°C, which enables the joints to sustain rather high temperatures.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Transient Liquid Phase Bonding of Copper and AISI 304 L Using Tin and Indium Interlayers for High-Temperature Service Applications

  • 期刊论文

  • 发表日期：

    2025年4月14日

查看全文
  • Saeid Nahri

摘要

The potential of the transient liquid phase (TLP) process to obtain appropriate bonding between AISI 304 L stainless steel and copper was evaluated via two different interlayers of indium and tin. For this purpose, TLP bonding was performed at 650 °C and 700 °C using indium and tin interlayers, respectively, for two different times of 10 and 20 minutes. To overcome the wettability barrier of stainless steel due to its oxide layer, tin and indium pre-soldered onto the surface of stainless steel, which not only overcomes the low wettability of stainless steel but also makes it possible to perform TLP bonding in an air atmosphere. When the bonding time was increased to 10 and then 20 minutes, due to isothermal solidification, a δ-free microstructure of the Cu(Sn) and Cu(In) solid solutions with a rather homogeneous composition and hardness and maximum shear strengths of 162 and 173 MPa, respectively, formed in the joint areas. In addition, the joints not only exhibit a ductile dimple mode of fracture but also increase the remelting temperature of the formed (Cu) solid solutions to approximately 1000 °C, which enables the joints to sustain rather high temperatures.