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<p>In this study, the effect of varying durations of Ar plasma cleaning on the interfacial bonding properties of PTFE/copper composites was examined. PTFE/copper composites were fabricated using magnetron sputtering in a vacuum chamber, with titanium serving as an intermediate transition layer and copper as the plating metal. The results demonstrated that the interfacial bonding strength of PTFE/copper composites peaked after 80&#xa0;s of plasma treatment.&#xa0;The highest pull-off strength of PTFE/copper is 9.19&#xa0;MPa. The transition layer of titanium contributes to the bonding strength between PTFE and copper. XPS analysis indicated that titanium formed a small amount of Ti-F bonds with fluorine in PTFE and a small quantity of Ti-C bonds with carbon in PTFE. The high bond strength of the copper layer is attributed to the diffusion of copper atoms into the PTFE matrix. The relationship between PTFE/copper strength and surface roughness was observed to be inversely proportional, suggesting that increased roughness results in reduced bond strength of the copper layer. For a copper layer thickness of 10&#xa0;µm, the bonding strength of the electroplated thickened copper layer was found to be superior to that of the fully magnetron-sputtered thickened layer.</p>

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Effect of Magnetron Sputtering Process on the Bonding of Copper Layers on Polytetrafluoroethylene Surfaces

  • 期刊论文

  • 发表日期：

    2025年2月4日

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  • Ruijun Wang,
  • Jiankun Nie,
  • Puren Liu,
  • Xiaolu Pang,
  • Lining Xu,
  • Lijie Qiao

摘要

In this study, the effect of varying durations of Ar plasma cleaning on the interfacial bonding properties of PTFE/copper composites was examined. PTFE/copper composites were fabricated using magnetron sputtering in a vacuum chamber, with titanium serving as an intermediate transition layer and copper as the plating metal. The results demonstrated that the interfacial bonding strength of PTFE/copper composites peaked after 80 s of plasma treatment. The highest pull-off strength of PTFE/copper is 9.19 MPa. The transition layer of titanium contributes to the bonding strength between PTFE and copper. XPS analysis indicated that titanium formed a small amount of Ti-F bonds with fluorine in PTFE and a small quantity of Ti-C bonds with carbon in PTFE. The high bond strength of the copper layer is attributed to the diffusion of copper atoms into the PTFE matrix. The relationship between PTFE/copper strength and surface roughness was observed to be inversely proportional, suggesting that increased roughness results in reduced bond strength of the copper layer. For a copper layer thickness of 10 µm, the bonding strength of the electroplated thickened copper layer was found to be superior to that of the fully magnetron-sputtered thickened layer.