<p>The FeCoNiCrAl high-entropy alloys prepared by laser additive manufacturing are promising for a wide range of applications. In this study, samples of FeCoNiCrAl high-entropy alloy fabricated by laser additive manufacturing under different process conditions were investigated. In this study, two kinds of laser additive methods without interlayer cooling and interlayer cooling were used, respectively, and the experimental results were compared, and the microstructure and composition were analyzed. The results show that both samples are mainly composed of disordered BCC solid solution and ordered B2 cubic structure. The microstructure of both samples changed from columnar to equiaxed grains due to the different thermal gradients and solidification rates at the top and bottom of each layer. The equiaxed grain size of the sample with interlayer cooling was smaller than that of the sample without interlayer cooling due to the difference in undercooling, which caused the microhardness of the sample with interlayer cooling to be larger than that of the sample without interlayer cooling.</p>

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Effect of Interlayer Cooling on Microstructure and Microhardness of FeCoNiCrAl High-Entropy Alloy Fabricated by Laser Additive Manufacturing

  • Zengrong Hu,
  • Mingrui Chen,
  • Zhikang Wu,
  • Shuncun Luo,
  • Xiaonan Wang,
  • Jiale Xu,
  • Hai Zhang

摘要

The FeCoNiCrAl high-entropy alloys prepared by laser additive manufacturing are promising for a wide range of applications. In this study, samples of FeCoNiCrAl high-entropy alloy fabricated by laser additive manufacturing under different process conditions were investigated. In this study, two kinds of laser additive methods without interlayer cooling and interlayer cooling were used, respectively, and the experimental results were compared, and the microstructure and composition were analyzed. The results show that both samples are mainly composed of disordered BCC solid solution and ordered B2 cubic structure. The microstructure of both samples changed from columnar to equiaxed grains due to the different thermal gradients and solidification rates at the top and bottom of each layer. The equiaxed grain size of the sample with interlayer cooling was smaller than that of the sample without interlayer cooling due to the difference in undercooling, which caused the microhardness of the sample with interlayer cooling to be larger than that of the sample without interlayer cooling.