Dynamic Response and Microstructure Evolution of Ta-2.5W and Cu Under Detonation Loading

The dynamic response and microstructure evolution of Ta-2.5W and Cu flyers under detonation loading are investigated using electron backscatter diffraction (EBSD), transmission electron microscopy (TEM), etc. During the dynamic loading process, the flyer exhibited uneven deformation, with the center experiencing more deformation than the periphery. Moreover, the flyer undergoes more deformation when located near the detonators compared to the flyer far away from the detonators. Both Cu (face-centered-cubic structure) and Ta-2.5W (body-centered-cubic structure) showed similar microstructure evolution, characterized by a compressed-type texture consistent with VPSC simulation results. Ta-2.5W exhibits less pronounced lamination failure degree than Cu and demonstrates greater resistance to deformation failure. The failure process involves nucleation, growth, connection, and junction of cracks and voids, ultimately leading to scab detachment. This research provides experimental insights into the evolution and failure mechanisms under detonations for metals with different crystal structures.