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<p>Foldable transparent conductive electrodes (TCEs) require high conductivity, transparency, mechanical reliability under extreme deformation, and environmental stability, while sustainable substrate selection remains a major challenge. Here, we report the development of a bio-based foldable TCE by integrating room-temperature electroplating-assisted welding of silver nanowire (Ag NW) networks with an embedding-transfer strategy using chitosan as the substrate. Electrochemical welding converts weak nanowire junctions into robust metallic contacts, thereby markedly reducing junction resistance, while partial embedding of the welded network into the chitosan matrix enhances adhesion, folding durability, and oxidation resistance. The welded Ag NW/chitosan composite TCEs achieve a sheet resistance of 9.3&#xa0;Ω/sq at a transmittance of 84% (including the substrate), with a figure of merit of ~ 216. The TCEs show negligible resistance change after 20 tape-peeling cycles and less than 20% resistance increase after 10,000 folding cycles at a bending radius of 50&#xa0;μm. They also exhibit excellent resistance to ultraviolet–ozone exposure and maintain stable conductivity after 100&#xa0;days of ambient storage. This work provides a simple and effective route toward sustainable foldable optoelectronics.</p>

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High-Performance Bio-Based Transparent Electrodes from Electrochemically Welded Silver Nanowire Network

  • 期刊论文

  • 发表日期：

    2026年6月27日

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  • Zheng Wu,
  • Zhenzhong Huang,
  • Le Zhao,
  • Shihui Yu

摘要

Foldable transparent conductive electrodes (TCEs) require high conductivity, transparency, mechanical reliability under extreme deformation, and environmental stability, while sustainable substrate selection remains a major challenge. Here, we report the development of a bio-based foldable TCE by integrating room-temperature electroplating-assisted welding of silver nanowire (Ag NW) networks with an embedding-transfer strategy using chitosan as the substrate. Electrochemical welding converts weak nanowire junctions into robust metallic contacts, thereby markedly reducing junction resistance, while partial embedding of the welded network into the chitosan matrix enhances adhesion, folding durability, and oxidation resistance. The welded Ag NW/chitosan composite TCEs achieve a sheet resistance of 9.3 Ω/sq at a transmittance of 84% (including the substrate), with a figure of merit of ~ 216. The TCEs show negligible resistance change after 20 tape-peeling cycles and less than 20% resistance increase after 10,000 folding cycles at a bending radius of 50 μm. They also exhibit excellent resistance to ultraviolet–ozone exposure and maintain stable conductivity after 100 days of ambient storage. This work provides a simple and effective route toward sustainable foldable optoelectronics.