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<p>High-entropy alloys (HEAs) have gained widespread attention across multiple fields due to their distinctive microstructure, high electrical and thermal stability, and exceptional mechanical strength, which enables them to outperform conventional standard alloys. Herein, we study the effect of incorporating MnSi<sub>1.8</sub> (higher manganese silicide or HMS) into Ti<sub>2</sub>NiCoSnSb<sub>0.95</sub>Bi<sub>0.05</sub> HEA to determine its thermoelectric behaviour. The <i>x</i> wt.% HMS + Ti<sub>2</sub>NiCoSnSb<sub>0.95</sub>Bi<sub>0.05</sub> (<i>x</i> = 0, 5, 10, 20) composites were prepared by vacuum arc melting followed by consolidation using spark plasma sintering (SPS). The powder x-ray diffraction pattern confirms the half-Heusler (HH) MgAgAs-type structure and the successful incorporation of HMS into the primary HEA matrix. Furthermore, the backscattered electron micrograph with energy-dispersive x-ray (EDX) elemental mapping confirms the majority HH phase, along with the segregation of an HMS-rich secondary phase. Moreover, as the weight percentage of HMS increases, the electrical conductivity increases from ~0.98 × 10<sup>5</sup>&#xa0;S/m (5% HMS/HH) to ~1.81 × 10<sup>5</sup>&#xa0;S/m (20% HMS/HH) at 673&#xa0;K. The incorporation of HMS composite reduces the lattice thermal conductivity to ~1.76&#xa0;W/mK for 20% HMS/HH from ~4.50&#xa0;W/mK (5% HMS/HH) at 673&#xa0;K. This reduction is attributed to increased point defects and enhanced phonon scattering at HMS/HH interfaces. Overall, the largest figure of merit is obtained at ~0.07 for 20% HMS/HH.</p>

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Suppression of Lattice Thermal Conductivity in Ti2NiCoSnSb0.95Bi0.05-Reinforced MnSi1.8 Composite

  • 期刊论文

  • 发表日期：

    2026年6月18日

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  • B. S. Subathra,
  • Madhuvathani Saminathan,
  • Prince Wesley,
  • Lokeshwaran Ravi,
  • A. K. Panda,
  • R. Mythili,
  • Bhuvanesh Srinivasan,
  • Suresh Perumal,
  • Ravi Kirana

摘要

High-entropy alloys (HEAs) have gained widespread attention across multiple fields due to their distinctive microstructure, high electrical and thermal stability, and exceptional mechanical strength, which enables them to outperform conventional standard alloys. Herein, we study the effect of incorporating MnSi1.8 (higher manganese silicide or HMS) into Ti2NiCoSnSb0.95Bi0.05 HEA to determine its thermoelectric behaviour. The x wt.% HMS + Ti2NiCoSnSb0.95Bi0.05 (x = 0, 5, 10, 20) composites were prepared by vacuum arc melting followed by consolidation using spark plasma sintering (SPS). The powder x-ray diffraction pattern confirms the half-Heusler (HH) MgAgAs-type structure and the successful incorporation of HMS into the primary HEA matrix. Furthermore, the backscattered electron micrograph with energy-dispersive x-ray (EDX) elemental mapping confirms the majority HH phase, along with the segregation of an HMS-rich secondary phase. Moreover, as the weight percentage of HMS increases, the electrical conductivity increases from ~0.98 × 105 S/m (5% HMS/HH) to ~1.81 × 105 S/m (20% HMS/HH) at 673 K. The incorporation of HMS composite reduces the lattice thermal conductivity to ~1.76 W/mK for 20% HMS/HH from ~4.50 W/mK (5% HMS/HH) at 673 K. This reduction is attributed to increased point defects and enhanced phonon scattering at HMS/HH interfaces. Overall, the largest figure of merit is obtained at ~0.07 for 20% HMS/HH.