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<p>With the advantage of finer temperature control of chips, a glass core substrate (GCS) was developed to improve chip performance based on through-glass via (TGV) technology. For TGV technology, two core techniques were employed: laser-induced etching rapid prototyping (LIERP) and metal filling in glass through holes. For LIERP, the diameter and roundness of the through holes on the front and back sides of the glass were all measured to verify the uniformity of the through holes formed. For a designed diameter of 55&#xa0;μm, the average diameter and average roundness among 20 glass through holes measured on both the front and back sides were 54.917&#xa0;μm and 0.492&#xa0;μm, respectively. For a designed distance between adjacent glass through holes of 200&#xa0;μm in both <i>x</i> and <i>y</i> directions, the average distance between adjacent glass through holes was 200.072&#xa0;μm. For metal filling in glass through holes, three steps, including precise control of aperture and depth for the glass through holes, careful selection of filling materials, and optimization of the metal filling process, were undertaken to achieve high quality of metal filling in glass through holes.</p>

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Research on a Glass Core Substrate Based on TGV Technology

  • 期刊论文

  • 发表日期：

    2026年5月11日

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  • Jikang Liu,
  • Yao Wang

摘要

With the advantage of finer temperature control of chips, a glass core substrate (GCS) was developed to improve chip performance based on through-glass via (TGV) technology. For TGV technology, two core techniques were employed: laser-induced etching rapid prototyping (LIERP) and metal filling in glass through holes. For LIERP, the diameter and roundness of the through holes on the front and back sides of the glass were all measured to verify the uniformity of the through holes formed. For a designed diameter of 55 μm, the average diameter and average roundness among 20 glass through holes measured on both the front and back sides were 54.917 μm and 0.492 μm, respectively. For a designed distance between adjacent glass through holes of 200 μm in both x and y directions, the average distance between adjacent glass through holes was 200.072 μm. For metal filling in glass through holes, three steps, including precise control of aperture and depth for the glass through holes, careful selection of filling materials, and optimization of the metal filling process, were undertaken to achieve high quality of metal filling in glass through holes.