<p>Owing to the outstanding material quality and improved resistance to heating effects, the ultra-wide-bandgap&#xa0;semiconductor of <i>β</i>-Ga<sub>2</sub>O<sub>3</sub> is being intensely assessed for the future generation of vertical high electron mobility transistors (HEMT). However, for channel temperatures above 450&#xa0;K, Al<sub>2</sub>O<sub>3</sub>/<i>β</i>-Ga<sub>2</sub>O<sub>3</sub> still demonstrates considerable limitations owing to the self-heating and trapping effect, and to address this problem, various technological approaches are being extensively explored. In this work, we report the analytical self-heat spreading model for the structure of the stacked AIN/<i>β</i>-Ga<sub>2</sub>O<sub>3</sub> HEMT. The self-heat spreading model was realized by the stacked AIN-beside-gate epilayer. The proposed device’s self-heating effect only became evident at <i>V</i><sub>GS</sub> = 3&#xa0;V while the self-heating was mitigated from −1&#xa0;V to 2&#xa0;V owing to the trap densities, which stood at 2 × 10<sup>11</sup> over a range of 300–492&#xa0;K. Direct-current (DC) and radiofrequency (RF) improved significantly. Transconductance was enhanced by 100%, drain current <i>I</i><sub>DS</sub>by 3.8%, off-state leakage current breakdown voltage by 39%, as well as excellent <i>I</i><sub>ON</sub>/<i>I</i><sub>OFF</sub> ratio performance of <InlineEquation ID="IEq1"> <EquationSource Format="TEX">\(\sim\)</EquationSource> <EquationSource Format="MATHML"><math> <mo>∼</mo> </math></EquationSource> </InlineEquation> 10<sup>14</sup>, and the channel temperature dropped by 35%. RF parameters of <i>f</i><sub>T</sub>/<i>f</i><sub>max</sub> improved by 50%. The results show the potential of AIN/<i>β</i>-Ga<sub>2</sub>O<sub>3</sub> for future avionics, and space engineering application electronics.</p>

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Unique Analytical Heat Spreading Model of β-Ga2O3 Buffer Trap Engineered for High Temperature and Frequency Performance of Power AlN/β-Ga2O3 HEMT

  • Yusuf U. Tarauni,
  • P. Murugapandiyan,
  • Inuwa Aliyu Faragai,
  • Garba Galadanchi,
  • N. MohanKumar,
  • K. Janani Sivasankar,
  • John D. Thiruvadigal

摘要

Owing to the outstanding material quality and improved resistance to heating effects, the ultra-wide-bandgap semiconductor of β-Ga2O3 is being intensely assessed for the future generation of vertical high electron mobility transistors (HEMT). However, for channel temperatures above 450 K, Al2O3/β-Ga2O3 still demonstrates considerable limitations owing to the self-heating and trapping effect, and to address this problem, various technological approaches are being extensively explored. In this work, we report the analytical self-heat spreading model for the structure of the stacked AIN/β-Ga2O3 HEMT. The self-heat spreading model was realized by the stacked AIN-beside-gate epilayer. The proposed device’s self-heating effect only became evident at VGS = 3 V while the self-heating was mitigated from −1 V to 2 V owing to the trap densities, which stood at 2 × 1011 over a range of 300–492 K. Direct-current (DC) and radiofrequency (RF) improved significantly. Transconductance was enhanced by 100%, drain current IDSby 3.8%, off-state leakage current breakdown voltage by 39%, as well as excellent ION/IOFF ratio performance of \(\sim\) 1014, and the channel temperature dropped by 35%. RF parameters of fT/fmax improved by 50%. The results show the potential of AIN/β-Ga2O3 for future avionics, and space engineering application electronics.