Enhanced Ferroelectricity and Reliability in Hf0.5Zr0.5O2 Thin Film via Synergistic Stress-Interface Effects from a W Top Electrode
摘要
Hf0.5Zr0.5O2 (HZO) thin film ferroelectrics (FEs) offer high scalability and complementary metal–oxide semiconductor (CMOS) compatibility, yet their performance is strongly influenced by electrode-induced stress and interfacial chemistry. This work compared three capacitor configurations: Mo/HZO/Mo, Mo/HZO/W, and W/HZO/Mo, to reveal the synergistic effects of mechanical stress and interface chemistry on the FE and reliability of the HZO thin film. The results showed that the symmetric Mo/HZO/Mo stack had the highest o-phase fraction (66.2%), while the asymmetric Mo/HZO/W stack achieved the maximum 2Pr (52.0 μC cm−2) at 4.0 MV cm−1, which was superior to previous similar studies. In addition, the Mo/HZO/W stack exhibited the lowest leakage current density (1.2 × 10−4 A cm−2 at 3.0 MV cm−1) and excellent durability (> 109 cycles), attributed to the high work function and oxidation resistance of the W electrode. In contrast, the W/HZO/Mo stack had the best retention characteristics owing to the stability of the bottom W interface (99.1% retention after 3.5 × 104 s). These findings indicate that the Mo/HZO/W stack achieved the optimal balance between polarization strength and operational reliability, providing important references for the design of high performance HZO-based memory devices.