<p>The exceptional electrical and mechanical properties of graphene make it a leading candidate for advanced electronic and sensing applications; however, its integration into functional devices often requires high-<InlineEquation ID="IEq3"> <EquationSource Format="TEX">\(\kappa \)</EquationSource> <EquationSource Format="MATHML"><math> <mi>κ</mi> </math></EquationSource> </InlineEquation> dielectric layers, such as aluminum oxide (<InlineEquation ID="IEq4"> <EquationSource Format="TEX">\(\hbox {Al}_2\hbox {O}_{3}\)</EquationSource> <EquationSource Format="MATHML"><math> <mrow> <msub> <mtext>Al</mtext> <mn>2</mn> </msub> <msub> <mtext>O</mtext> <mn>3</mn> </msub> </mrow> </math></EquationSource> </InlineEquation>). Atomic layer deposition (ALD) is a promising technique for growing such dielectric films due to the excellent thickness control and good uniformity that can be achieved. Despite these benefits, ALD-based <InlineEquation ID="IEq5"> <EquationSource Format="TEX">\(\hbox {Al}_2\hbox {O}_{3}\)</EquationSource> <EquationSource Format="MATHML"><math> <mrow> <msub> <mtext>Al</mtext> <mn>2</mn> </msub> <msub> <mtext>O</mtext> <mn>3</mn> </msub> </mrow> </math></EquationSource> </InlineEquation> deposition on graphene can unintentionally degrade the quality of the graphene by introducing strain, doping, or defects during the deposition process. Understanding how these effects vary with the early-stage thickness of the dielectric layer is essential for optimizing device performance. This study presents a systematic investigation of the structural modification induced in monolayer graphene as a function of ALD-deposited <InlineEquation ID="IEq6"> <EquationSource Format="TEX">\(\hbox {Al}_2\hbox {O}_{3}\)</EquationSource> <EquationSource Format="MATHML"><math> <mrow> <msub> <mtext>Al</mtext> <mn>2</mn> </msub> <msub> <mtext>O</mtext> <mn>3</mn> </msub> </mrow> </math></EquationSource> </InlineEquation> dielectric thickness. A mechanically exfoliated single-layer graphene sample was transferred onto Si/<InlineEquation ID="IEq7"> <EquationSource Format="TEX">\(\hbox {SiO}_{2}\)</EquationSource> <EquationSource Format="MATHML"><math> <msub> <mtext>SiO</mtext> <mn>2</mn> </msub> </math></EquationSource> </InlineEquation> substrates and subsequently coated with <InlineEquation ID="IEq8"> <EquationSource Format="TEX">\(\hbox {Al}_{2}\hbox {O}_{3}\)</EquationSource> <EquationSource Format="MATHML"><math> <mrow> <msub> <mtext>Al</mtext> <mn>2</mn> </msub> <msub> <mtext>O</mtext> <mn>3</mn> </msub> </mrow> </math></EquationSource> </InlineEquation> films of varying thicknesses. <InlineEquation ID="IEq9"> <EquationSource Format="TEX">\(\hbox {Al}_{2}\hbox {O}_{3}\)</EquationSource> <EquationSource Format="MATHML"><math> <mrow> <msub> <mtext>Al</mtext> <mn>2</mn> </msub> <msub> <mtext>O</mtext> <mn>3</mn> </msub> </mrow> </math></EquationSource> </InlineEquation> deposition was carried out via direct <InlineEquation ID="IEq10"> <EquationSource Format="TEX">\(\hbox {H}_2\hbox {O}\)</EquationSource> <EquationSource Format="MATHML"><math> <mrow> <msub> <mtext>H</mtext> <mn>2</mn> </msub> <mtext>O</mtext> </mrow> </math></EquationSource> </InlineEquation>-based ALD at 120°C, without any surface pretreatment, to avoid initial damage to the graphene prior to the start of <InlineEquation ID="IEq12"> <EquationSource Format="TEX">\(\hbox {Al}_{2}\hbox {O}_{3}\)</EquationSource> <EquationSource Format="MATHML"><math> <mrow> <msub> <mtext>Al</mtext> <mn>2</mn> </msub> <msub> <mtext>O</mtext> <mn>3</mn> </msub> </mrow> </math></EquationSource> </InlineEquation> deposition. Damage to graphene during the deposition process was analyzed by varying the film thickness of <InlineEquation ID="IEq13"> <EquationSource Format="TEX">\(\hbox {Al}_{2}\hbox {O}_{3}\)</EquationSource> <EquationSource Format="MATHML"><math> <mrow> <msub> <mtext>Al</mtext> <mn>2</mn> </msub> <msub> <mtext>O</mtext> <mn>3</mn> </msub> </mrow> </math></EquationSource> </InlineEquation>, and Raman spectroscopy performed at each stage of sample preparation made it possible to evaluate the impact of the <InlineEquation ID="IEq14"> <EquationSource Format="TEX">\(\hbox {Al}_{2}\hbox {O}_{3}\)</EquationSource> <EquationSource Format="MATHML"><math> <mrow> <msub> <mtext>Al</mtext> <mn>2</mn> </msub> <msub> <mtext>O</mtext> <mn>3</mn> </msub> </mrow> </math></EquationSource> </InlineEquation> coating on the graphene layer. This work reveals that defect, strain, and doping dynamics at the Si/<InlineEquation ID="IEq15"> <EquationSource Format="TEX">\(\hbox {SiO}_{2}\)</EquationSource> <EquationSource Format="MATHML"><math> <msub> <mtext>SiO</mtext> <mn>2</mn> </msub> </math></EquationSource> </InlineEquation>/<InlineEquation ID="IEq16"> <EquationSource Format="TEX">\(\hbox {Al}_{2}\hbox {O}_{3}\)</EquationSource> <EquationSource Format="MATHML"><math> <mrow> <msub> <mtext>Al</mtext> <mn>2</mn> </msub> <msub> <mtext>O</mtext> <mn>3</mn> </msub> </mrow> </math></EquationSource> </InlineEquation>/graphene interface are strongly influenced by early-stage dielectric thickness, offering an effective strategy to minimize damage and preserve graphene’s intrinsic properties—an essential step toward the development of high-performance graphene-based electronic devices.</p>

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Structural Modification of Monolayer Graphene Induced by Atomic Layer Deposition of Al2O3 Dielectric

  • Dhammika Rathnayaka,
  • Riya Sharma,
  • Eesha Razia,
  • Kisaru Upananda,
  • Prachanda Bhurtel,
  • Bidur Dahal,
  • Rameshwor Poudel,
  • U. Kushan Wijewardena,
  • Annika Kriisa,
  • Rasanga Samaraweera,
  • Ramesh G. Mani

摘要

The exceptional electrical and mechanical properties of graphene make it a leading candidate for advanced electronic and sensing applications; however, its integration into functional devices often requires high- \(\kappa \) κ dielectric layers, such as aluminum oxide ( \(\hbox {Al}_2\hbox {O}_{3}\) Al 2 O 3 ). Atomic layer deposition (ALD) is a promising technique for growing such dielectric films due to the excellent thickness control and good uniformity that can be achieved. Despite these benefits, ALD-based \(\hbox {Al}_2\hbox {O}_{3}\) Al 2 O 3 deposition on graphene can unintentionally degrade the quality of the graphene by introducing strain, doping, or defects during the deposition process. Understanding how these effects vary with the early-stage thickness of the dielectric layer is essential for optimizing device performance. This study presents a systematic investigation of the structural modification induced in monolayer graphene as a function of ALD-deposited \(\hbox {Al}_2\hbox {O}_{3}\) Al 2 O 3 dielectric thickness. A mechanically exfoliated single-layer graphene sample was transferred onto Si/ \(\hbox {SiO}_{2}\) SiO 2 substrates and subsequently coated with \(\hbox {Al}_{2}\hbox {O}_{3}\) Al 2 O 3 films of varying thicknesses. \(\hbox {Al}_{2}\hbox {O}_{3}\) Al 2 O 3 deposition was carried out via direct \(\hbox {H}_2\hbox {O}\) H 2 O -based ALD at 120°C, without any surface pretreatment, to avoid initial damage to the graphene prior to the start of \(\hbox {Al}_{2}\hbox {O}_{3}\) Al 2 O 3 deposition. Damage to graphene during the deposition process was analyzed by varying the film thickness of \(\hbox {Al}_{2}\hbox {O}_{3}\) Al 2 O 3 , and Raman spectroscopy performed at each stage of sample preparation made it possible to evaluate the impact of the \(\hbox {Al}_{2}\hbox {O}_{3}\) Al 2 O 3 coating on the graphene layer. This work reveals that defect, strain, and doping dynamics at the Si/ \(\hbox {SiO}_{2}\) SiO 2 / \(\hbox {Al}_{2}\hbox {O}_{3}\) Al 2 O 3 /graphene interface are strongly influenced by early-stage dielectric thickness, offering an effective strategy to minimize damage and preserve graphene’s intrinsic properties—an essential step toward the development of high-performance graphene-based electronic devices.