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<p>With the continuous technological advancements of human society, thermal fatigue failure has become a primary failure mode limiting the service life of electronic equipment in automotive, telecommunications, aerospace, and military applications. In accordance with the IPC-TM-650 standard, this study conducted thermal shock testing from −55°C to 125°C at a ramp rate of 1.5°C/s to evaluate the thermal fatigue reliability of Sn-9Zn/hot air solder leveling (HASL) printed circuit board (PCB) under rapid temperature variations. The results demonstrated that the shear strength of Sn-9Zn joints consistently exceeded that of Sn-37Pb joints by approximately 10–15&#xa0;MPa, with the performance gap progressively widening from 24.2% to 63.6% over the course of cycling. The evolution of shear strength was initially governed by intermetallic compound (IMC) growth, then shifted to thermal fatigue damage after 1000 cycles.</p>

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Microstructure and Shear Strength Evolution in Sn-9Zn Solder Joints on HASL PCB During Thermal Shock Testing

  • 期刊论文

  • 发表日期：

    2026年7月7日

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  • Hao Fu,
  • Kun Xu,
  • Tianyuan Chen,
  • Andong Wang,
  • Gong Zhang

摘要

With the continuous technological advancements of human society, thermal fatigue failure has become a primary failure mode limiting the service life of electronic equipment in automotive, telecommunications, aerospace, and military applications. In accordance with the IPC-TM-650 standard, this study conducted thermal shock testing from −55°C to 125°C at a ramp rate of 1.5°C/s to evaluate the thermal fatigue reliability of Sn-9Zn/hot air solder leveling (HASL) printed circuit board (PCB) under rapid temperature variations. The results demonstrated that the shear strength of Sn-9Zn joints consistently exceeded that of Sn-37Pb joints by approximately 10–15 MPa, with the performance gap progressively widening from 24.2% to 63.6% over the course of cycling. The evolution of shear strength was initially governed by intermetallic compound (IMC) growth, then shifted to thermal fatigue damage after 1000 cycles.