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<p>Although Sn58Bi solder offers numerous advantages, including a low melting point, its poor ductility and reliability hinder its widespread application in the electronics industry. Nanoparticles exhibit excellent performance as reinforcements, and ceramic nanoparticles in particular have been widely investigated as additives for Sn58Bi solders because of their low cost and high chemical stability. However, most previous studies have focused primarily on mechanical strength rather than ductility. In this study, we assessed the effect of MoS<sub>2</sub> nanoparticle addition on reliability by calculating the fracture energy, which reflects both strength and ductility. We prepared composite Sn58Bi solders incorporating different quantities of MoS<sub>2</sub> nanoparticles, defined as Sn58Bi-<i>x</i>MoS<sub>2</sub> (where <i>x</i> = 0, 0.1, 0.2, 0.3&#xa0;wt.%), and subjected them to different durations of isothermal heating to investigate the resulting changes in the melting point, microstructure, hardness, and shear properties. The MoS<sub>2</sub> nanoparticle content did not significantly affect the melting point of the Sn58Bi solder, but improved its other properties considerably. The incorporation of MoS<sub>2</sub> nanoparticles significantly refined the solder microstructure, reduced the average interphase spacing in Sn58Bi-0.2MoS<sub>2</sub> by 38.5% compared with that of pure Sn58Bi solder, reduced the interfacial intermetallic compound thickness, and substantially improved the solder hardness, shear strength, and fracture energy. The results of this study support the incorporation of MoS<sub>2</sub> nanoparticles in Sn58Bi solder to realize safe and effective soldering in electronic packaging applications.</p> Graphical Abstract <p></p>

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Effects of MoS2 Content on the Microstructure and Mechanical Properties of Low-Melting-Temperature Sn-Bi Solder Joints

  • 期刊论文

  • 发表日期：

    2026年1月7日

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  • Hyeon-Tae Kim,
  • Jeong-Won Yoon

摘要

Although Sn58Bi solder offers numerous advantages, including a low melting point, its poor ductility and reliability hinder its widespread application in the electronics industry. Nanoparticles exhibit excellent performance as reinforcements, and ceramic nanoparticles in particular have been widely investigated as additives for Sn58Bi solders because of their low cost and high chemical stability. However, most previous studies have focused primarily on mechanical strength rather than ductility. In this study, we assessed the effect of MoS2 nanoparticle addition on reliability by calculating the fracture energy, which reflects both strength and ductility. We prepared composite Sn58Bi solders incorporating different quantities of MoS2 nanoparticles, defined as Sn58Bi-xMoS2 (where x = 0, 0.1, 0.2, 0.3 wt.%), and subjected them to different durations of isothermal heating to investigate the resulting changes in the melting point, microstructure, hardness, and shear properties. The MoS2 nanoparticle content did not significantly affect the melting point of the Sn58Bi solder, but improved its other properties considerably. The incorporation of MoS2 nanoparticles significantly refined the solder microstructure, reduced the average interphase spacing in Sn58Bi-0.2MoS2 by 38.5% compared with that of pure Sn58Bi solder, reduced the interfacial intermetallic compound thickness, and substantially improved the solder hardness, shear strength, and fracture energy. The results of this study support the incorporation of MoS2 nanoparticles in Sn58Bi solder to realize safe and effective soldering in electronic packaging applications.

Graphical Abstract