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<p>Driven by the demand for miniaturized, highly integrated, and durable electronics, Sn-9Zn solder is being explored to overcome the reliability limitations of Sn-37Pb solder in hot-air solder leveling printed circuit boards. This study investigated the degradation in shear strength of Sn-9Zn solder during aging at 125°C for up to 1440&#xa0;h, and examined its correlation with the evolution of intermetallic compounds and joint microstructure. Experimental results confirmed that Sn-9Zn solder maintained a consistent strength advantage of 10-15&#xa0;MPa over Sn-37Pb, with its relative superiority increasing from 25.5% to 97.5% during the aging process. Furthermore, the experiments also revealed that the difference in mechanical properties between the two solders is attributable to the formation of Cu<sub>5</sub>Zn<sub>8</sub>, which is governed by the thermodynamic driving force of Zn.</p>

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Shear Strength and Microstructure Evolution of Sn-9Zn Solder on HASL PCB during Aging at 125°C

  • 期刊论文

  • 发表日期：

    2025年12月19日

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  • Hao Fu,
  • Tianyuan Chen,
  • Andong Wang,
  • Qingyu Shi,
  • Gong Zhang

摘要

Driven by the demand for miniaturized, highly integrated, and durable electronics, Sn-9Zn solder is being explored to overcome the reliability limitations of Sn-37Pb solder in hot-air solder leveling printed circuit boards. This study investigated the degradation in shear strength of Sn-9Zn solder during aging at 125°C for up to 1440 h, and examined its correlation with the evolution of intermetallic compounds and joint microstructure. Experimental results confirmed that Sn-9Zn solder maintained a consistent strength advantage of 10-15 MPa over Sn-37Pb, with its relative superiority increasing from 25.5% to 97.5% during the aging process. Furthermore, the experiments also revealed that the difference in mechanical properties between the two solders is attributable to the formation of Cu5Zn8, which is governed by the thermodynamic driving force of Zn.