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<p>In the soldering and operation stages of SAC305(Sn<sub>96.5</sub>Ag<sub>3.0</sub>Cu<sub>0.5</sub>) solder, the anisotropic growth of <i>η</i>′-Cu<sub>6</sub>Sn<sub>5</sub> at the interface of SAC305–Cu solder joints often results in joint failure. Thus, researching how alloying elements such as antimony (Sb) and bismuth (Bi) mitigate the anisotropy of <i>η</i>′-Cu<sub>6</sub>Sn<sub>5</sub> holds significant importance. This study employs the first-principles method to investigate the effects of Sb and Bi doping on the crystal structure, electronic structure, and mechanical properties of <i>η</i>′-Cu<sub>6</sub>Sn<sub>5</sub>. The calculation results show that Sb and Bi doping reduces the mechanical anisotropy of <i>η</i>′-Cu<sub>6</sub>Sn<sub>5</sub>, among which Sb doping particularly enhances the structural stability of <i>η</i>′-Cu<sub>6</sub>Sn<sub>5</sub>. Meanwhile, the introduction of Sb and Bi modifies the mechanical properties of <i>η</i>′-Cu<sub>6</sub>Sn<sub>5</sub>. Comparative analysis reveals that when Bi is doped at the Sn<sub>3</sub> site, it exhibits the most remarkable enhancement effect on multiple properties of <i>η</i>′-Cu<sub>6</sub>Sn<sub>5</sub>.This study provides a theoretical basis for exploring the performance improvement of <i>η</i>′-Cu<sub>6</sub>Sn<sub>5</sub> by doping with Sb and Bi elements.</p>

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Exploration of Alloy Element (Sb,Bi) Doped η′-Cu6Sn5: Structure, Elastic Anisotropy, Electronic Structure, and Fracture Toughness

  • 期刊论文

  • 发表日期：

    2025年11月25日

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  • Jian Zhao,
  • Jianhua Sheng,
  • Jiangshan Liu,
  • Senlin Yi,
  • Biao Wang,
  • Jikang Yan

摘要

In the soldering and operation stages of SAC305(Sn96.5Ag3.0Cu0.5) solder, the anisotropic growth of η′-Cu6Sn5 at the interface of SAC305–Cu solder joints often results in joint failure. Thus, researching how alloying elements such as antimony (Sb) and bismuth (Bi) mitigate the anisotropy of η′-Cu6Sn5 holds significant importance. This study employs the first-principles method to investigate the effects of Sb and Bi doping on the crystal structure, electronic structure, and mechanical properties of η′-Cu6Sn5. The calculation results show that Sb and Bi doping reduces the mechanical anisotropy of η′-Cu6Sn5, among which Sb doping particularly enhances the structural stability of η′-Cu6Sn5. Meanwhile, the introduction of Sb and Bi modifies the mechanical properties of η′-Cu6Sn5. Comparative analysis reveals that when Bi is doped at the Sn3 site, it exhibits the most remarkable enhancement effect on multiple properties of η′-Cu6Sn5.This study provides a theoretical basis for exploring the performance improvement of η′-Cu6Sn5 by doping with Sb and Bi elements.