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<p>In this work, transient liquid phase bonding was adopted to prepare Cu/In-48Sn-10Ag/Cu solder joints. The effect of bonding time on the microstructure, the growth behavior of intermetallic compounds (IMC), and the shear properties of the solder joints was studied. The results showed that the microstructure of the in situ reaction zone was composed of Ag<sub>2</sub>In and In-rich phases. The interfacial IMC of the solder joints was the Cu<sub>6</sub>(In, Sn)<sub>5</sub> phase when the bonding time was 2&#xa0;min. The interfacial IMC of the solder joints transformed from the Cu<sub>6</sub>(In, Sn)<sub>5</sub> phase to the Cu<sub>3</sub>(In, Sn) phase when the bonding time was 10&#xa0;min. With increasing bonding time, the In-rich phase in the in situ reaction zone gradually decreased, the Ag<sub>2</sub>In phase gradually increased, the thickness of the interfacial IMC increased, and the proportion of the Cu<sub>3</sub>(In, Sn) phase in the interfacial reaction zone increased. Cracks began to appear inside the solder joints when the bonding time was 60&#xa0;min. With increasing bonding time, the porosity of the solder joints first decreased and then increased, and the shear strength of the solder joints first increased and then decreased. The solder joints exhibited a dense structure when the bonding time was 30&#xa0;min, with the porosity reaching a minimum of 1.83% and the shear strength attaining a maximum of 13.69&#xa0;MPa. The growth exponent of the interfacial IMC of the solder joints was 0.13, and the growth rate was 1.99&#xa0;μm/s. The fracture mechanism of the all solder joints were brittle fracture, and the fracture location shifted from the in situ reaction zone to the interfacial reaction zone with increasing bonding time.</p>

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Effect of Bonding Time on the Microstructure, IMC Growth Behavior, and Shear Properties of Cu/In-48Sn-10Ag/Cu 3D Packaging Solder Joints

  • 期刊论文

  • 发表日期：

    2025年11月15日

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  • Zheng Liu,
  • Yuezhang Yang,
  • Li Yang,
  • Yucong He,
  • Yu Zhang

摘要

In this work, transient liquid phase bonding was adopted to prepare Cu/In-48Sn-10Ag/Cu solder joints. The effect of bonding time on the microstructure, the growth behavior of intermetallic compounds (IMC), and the shear properties of the solder joints was studied. The results showed that the microstructure of the in situ reaction zone was composed of Ag2In and In-rich phases. The interfacial IMC of the solder joints was the Cu6(In, Sn)5 phase when the bonding time was 2 min. The interfacial IMC of the solder joints transformed from the Cu6(In, Sn)5 phase to the Cu3(In, Sn) phase when the bonding time was 10 min. With increasing bonding time, the In-rich phase in the in situ reaction zone gradually decreased, the Ag2In phase gradually increased, the thickness of the interfacial IMC increased, and the proportion of the Cu3(In, Sn) phase in the interfacial reaction zone increased. Cracks began to appear inside the solder joints when the bonding time was 60 min. With increasing bonding time, the porosity of the solder joints first decreased and then increased, and the shear strength of the solder joints first increased and then decreased. The solder joints exhibited a dense structure when the bonding time was 30 min, with the porosity reaching a minimum of 1.83% and the shear strength attaining a maximum of 13.69 MPa. The growth exponent of the interfacial IMC of the solder joints was 0.13, and the growth rate was 1.99 μm/s. The fracture mechanism of the all solder joints were brittle fracture, and the fracture location shifted from the in situ reaction zone to the interfacial reaction zone with increasing bonding time.