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<p>Solder balls are essential components in bump fabrication for advanced electronic packaging. However, producing large-diameter solder balls (≥&#xa0;1.00&#xa0;mm) remains challenging due to difficulties in achieving consistent sphericity and dimensional control. In this study, we introduce a cutting-remelting hybrid process, supported by a custom-designed spheroidizing apparatus, that enables the fabrication of large solder balls from 42Sn58Bi, 63Sn37Pb, and Sn3Ag0.5Cu alloys. Systematic investigations highlight the strong dependence of spheroidization quality on process parameters, with temperature optimization and solder wire segment geometry identified as critical factors. For 42Sn58Bi, optimal results are obtained at a spheroidization temperature of 280°C, yielding solder balls with a diameter of 1.20&#xa0;mm and a nearly ideal spherical morphology. Further experiments demonstrated the effect initial wire dimensions on final ball geometry: solder balls produced from wire with a diameter of 1.00&#xa0;mm and a length of 1.15&#xa0;mm exhibited a relatively large size deviation of 12.1&#xa0;μm, yet achieved the best sphericity at 0.104%. When the length-to-diameter ratio deviates substantially from unity, greater mass redistribution is required, leading to excessive surface energy reduction and a higher susceptibility to nonuniform solidification. Collectively, these findings establish a scalable framework for precision solder ball manufacturing and address critical limitations affecting the reliability of advanced electronic packaging.</p> Graphical Abstract <p></p>

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Fabrication of Solder Balls Exceeding 1.00 mm via Controlled Cutting and Remelting Technology for Electronic Packaging Materials

  • 期刊论文

  • 发表日期：

    2025年10月21日

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  • Linze Li,
  • Tongju Wang,
  • Wenqian Zhang

摘要

Solder balls are essential components in bump fabrication for advanced electronic packaging. However, producing large-diameter solder balls (≥ 1.00 mm) remains challenging due to difficulties in achieving consistent sphericity and dimensional control. In this study, we introduce a cutting-remelting hybrid process, supported by a custom-designed spheroidizing apparatus, that enables the fabrication of large solder balls from 42Sn58Bi, 63Sn37Pb, and Sn3Ag0.5Cu alloys. Systematic investigations highlight the strong dependence of spheroidization quality on process parameters, with temperature optimization and solder wire segment geometry identified as critical factors. For 42Sn58Bi, optimal results are obtained at a spheroidization temperature of 280°C, yielding solder balls with a diameter of 1.20 mm and a nearly ideal spherical morphology. Further experiments demonstrated the effect initial wire dimensions on final ball geometry: solder balls produced from wire with a diameter of 1.00 mm and a length of 1.15 mm exhibited a relatively large size deviation of 12.1 μm, yet achieved the best sphericity at 0.104%. When the length-to-diameter ratio deviates substantially from unity, greater mass redistribution is required, leading to excessive surface energy reduction and a higher susceptibility to nonuniform solidification. Collectively, these findings establish a scalable framework for precision solder ball manufacturing and address critical limitations affecting the reliability of advanced electronic packaging.

Graphical Abstract