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<p>The demand for high-precision microscale adhesive lines in the fields of micromanufacturing and electronic packaging has increased significantly, and precise control of the size and morphology of the adhesive lines has become critical. The composite ultra-micro-adhesive continuous transfer scheme proposed in this paper, which introduces a spiral structure pipette needle and a high-precision adhesive control system, is an effective method for realizing precision packaging. This method is capable of achieving adhesive line widths below 100 μm, and the key to ensuring continuous and stable adhesive formation lies in the shear and break-up behavior of the liquid bridge. In this paper, a numerical simulation model of adhesive transfer is constructed, focusing on the influence of key process parameters, such as operation height and residence time, on the morphology and transfer behavior of the adhesive. The simulation results indicate that the operating height <i>h</i> = 8&#xa0;μm and the residence time <i>t</i> = 2&#xa0;s are the optimal parameter configurations to realize the process. The effect of the coupling between the initial flow rate and the moving velocity on the quality of the adhesive is further explored through the comparative analysis of numerical simulation and experimental validation. It is determined that the composite ultra-micro-adhesive transfer method is capable of stably generating adhesive lines from 50&#xa0;μm to 80 μm in width. This study provides a theoretical basis for the dynamic control and stability optimization of the microscale adhesive transfer process.</p>

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Numerical Simulation Study of Liquid Bridge Shear Behavior Guided by Spiral Structure for Ultra-Micro Adhesive Transfer

  • 期刊论文

  • 发表日期：

    2025年10月13日

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  • Huifang Liu,
  • Sa Chen,
  • Shangwei Lu,
  • Teng Ren,
  • Yunlong Chang,
  • Xi Chen

摘要

The demand for high-precision microscale adhesive lines in the fields of micromanufacturing and electronic packaging has increased significantly, and precise control of the size and morphology of the adhesive lines has become critical. The composite ultra-micro-adhesive continuous transfer scheme proposed in this paper, which introduces a spiral structure pipette needle and a high-precision adhesive control system, is an effective method for realizing precision packaging. This method is capable of achieving adhesive line widths below 100 μm, and the key to ensuring continuous and stable adhesive formation lies in the shear and break-up behavior of the liquid bridge. In this paper, a numerical simulation model of adhesive transfer is constructed, focusing on the influence of key process parameters, such as operation height and residence time, on the morphology and transfer behavior of the adhesive. The simulation results indicate that the operating height h = 8 μm and the residence time t = 2 s are the optimal parameter configurations to realize the process. The effect of the coupling between the initial flow rate and the moving velocity on the quality of the adhesive is further explored through the comparative analysis of numerical simulation and experimental validation. It is determined that the composite ultra-micro-adhesive transfer method is capable of stably generating adhesive lines from 50 μm to 80 μm in width. This study provides a theoretical basis for the dynamic control and stability optimization of the microscale adhesive transfer process.