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<p>Silver powders play a pivotal role in electronic applications due to their superior conductivity and chemical stability, where morphology and particle size critically determine performance. This work presents a controllable liquid-phase reduction strategy to synthesize spherical silver powders using ascorbic acid as an eco-friendly reductant and polyvinylpyrrolidone (PVP) as a morphology-directing agent. Key synthesis parameters, including reactant mixing mode, temperature (30&#xa0;°C), silver nitrate concentration (0.2&#xa0;mol/L), PVP dosage (5 wt%), and reducing solution pH (3.3), were systematically optimized to achieve monodisperse spherical particles with an average size of 2&#xa0;<i>μ</i>m. When formulated into sintered conductive pastes with 75 wt% silver loading, the optimized powder enabled exceptional electrical and mechanical performance: a low sheet resistance of 5.3 mΩ/sq and robust adhesion exceeding 20 N. These results demonstrate a scalable route to tailor silver powders for high-performance electronic interconnects in photovoltaic and 5G modules, balancing cost-efficiency with functional reliability.</p>

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Engineered Spherical Silver Powders for Low-Resistance Sintered Conductive Pastes

  • 期刊论文

  • 发表日期：

    2025年7月12日

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  • Xinran Wang,
  • Weigang Ma,
  • Yongming Hu,
  • Huabin Yang,
  • Junsheng Yang,
  • Chanatip Samart,
  • Nguyen-Minh-An Tran,
  • Suwadee Kongparakul,
  • Junfeng Wang,
  • Hua Tan,
  • Haibo Zhang

摘要

Silver powders play a pivotal role in electronic applications due to their superior conductivity and chemical stability, where morphology and particle size critically determine performance. This work presents a controllable liquid-phase reduction strategy to synthesize spherical silver powders using ascorbic acid as an eco-friendly reductant and polyvinylpyrrolidone (PVP) as a morphology-directing agent. Key synthesis parameters, including reactant mixing mode, temperature (30 °C), silver nitrate concentration (0.2 mol/L), PVP dosage (5 wt%), and reducing solution pH (3.3), were systematically optimized to achieve monodisperse spherical particles with an average size of 2 μm. When formulated into sintered conductive pastes with 75 wt% silver loading, the optimized powder enabled exceptional electrical and mechanical performance: a low sheet resistance of 5.3 mΩ/sq and robust adhesion exceeding 20 N. These results demonstrate a scalable route to tailor silver powders for high-performance electronic interconnects in photovoltaic and 5G modules, balancing cost-efficiency with functional reliability.