<p>Based on the size effect and surface effect, low-temperature sintering silver paste has attracted widespread attention as an interconnect material for power electronics due to its excellent mechanical strength, great electronic and thermal conductivity, and high-temperature resistance. Compared with nano-silver paste, micro-silver paste has the advantages of less organic material and lower production cost, making it one of the most popular interconnect materials in the power electronic packaging industry. To address the issue of large pore formation in micro-silver joints sintered at low temperature, the researchers have adopted pressure-assisted sintering or nano-silver particles doping technology to enhance the sintering driving force and to reduce the porosity of the sintered layer. Additionally, for the purpose of improving high-temperature service reliability, second-phase particles were introduced to enhance the microstructure stability and the mechanical performance of composite micro-silver joints. In this review, the research progress of low-temperature sintered micro-silver paste has been summarized, and various aspects including the sintering mechanism, mechanical performance, electrical and thermal conductivity, as well as high-temperature reliability of micro-silver paste, mixed micro-silver paste, and composite micro-silver paste are all discussed in detail. It is hoped to provide theoretical guidance for the research of developing micro-silver pastes with high performance and promoting broader application of low-temperature sintered micro-silver technology.</p>