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<p>In recent years, copper wire has become the primary bonding material for the packaging process. Due to its poor corrosion resistance, a precious metal plating (Pd, Au) is applied as a protective layer to form coated wire. However, the lack of plating density and defects caused by the electroplating process have led to galvanic corrosion, resulting in a low corrosion resistance reliability of Pd/Au-coated Cu (CPA) wire. This study selected CPA wire as the experimental material and conducted two types of vacuum heat treatments: (1) recrystallization at 275°C for 1 h, 4 h, 12 h, and 24&#xa0;h on fine copper wire, and (2) high-temperature short-time treatment at 500°C for 10 min. These treatments aimed to achieve surface micro-alloying characteristics and to evaluate wire bonding reliability. The experimental results indicated that, after 275°C-4&#xa0;h vacuum heat treatment, the resistance remained unchanged, and there was a slight inward diffusion of the Pd element into the Cu base (resulting in mild surface micro-alloying), enhancing the mechanical properties. After the 500°C-10&#xa0;min vacuum heat treatment, significant diffusion of Pd along the grain boundaries occurred, forming Cu<sub>3</sub>Pd in the subsurface, which increased corrosion resistance, with significant surface micro-alloying. Furthermore, this study evaluated the Cu-Cu bonding characteristics of surface micro-alloyed CPA wires, revealing that this method mitigated corrosion phenomena caused by potential differences at the joint interface, demonstrating excellent bonding reliability between CPA wires and Cu pads.</p>

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A Study of the Application Characteristics of Surface Micro-alloyed Fine Pd/Au-Coated Cu Wire and Wire Bonding Reliability of Cu Pad

  • 期刊论文

  • 发表日期：

    2025年5月9日

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  • Chung-Kai Hsu,
  • Fei-Yi Hung,
  • Bo-Ding Wu

摘要

In recent years, copper wire has become the primary bonding material for the packaging process. Due to its poor corrosion resistance, a precious metal plating (Pd, Au) is applied as a protective layer to form coated wire. However, the lack of plating density and defects caused by the electroplating process have led to galvanic corrosion, resulting in a low corrosion resistance reliability of Pd/Au-coated Cu (CPA) wire. This study selected CPA wire as the experimental material and conducted two types of vacuum heat treatments: (1) recrystallization at 275°C for 1 h, 4 h, 12 h, and 24 h on fine copper wire, and (2) high-temperature short-time treatment at 500°C for 10 min. These treatments aimed to achieve surface micro-alloying characteristics and to evaluate wire bonding reliability. The experimental results indicated that, after 275°C-4 h vacuum heat treatment, the resistance remained unchanged, and there was a slight inward diffusion of the Pd element into the Cu base (resulting in mild surface micro-alloying), enhancing the mechanical properties. After the 500°C-10 min vacuum heat treatment, significant diffusion of Pd along the grain boundaries occurred, forming Cu3Pd in the subsurface, which increased corrosion resistance, with significant surface micro-alloying. Furthermore, this study evaluated the Cu-Cu bonding characteristics of surface micro-alloyed CPA wires, revealing that this method mitigated corrosion phenomena caused by potential differences at the joint interface, demonstrating excellent bonding reliability between CPA wires and Cu pads.