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<p>As an important material in the production of silicon heterojunction solar cells, low-temperature curing silver paste is typically used for screen printing on both surfaces of solar cells and then forms silver grid electrodes through low-temperature metallization. However, the preparation of low-temperature silver paste with excellent conductive and mechanical performance remains a challenge. This work mainly focused on the key components of low-temperature silver paste, including silver powder and organic vehicle, and investigated their effects on the rheological properties, printability, electrical conductivity, adhesion strength, and microstructural morphology. The study further explored an effective approach for the preparation of high-quality low-temperature silver paste based on the material selection and formulation optimization of both silver powder and organic vehicle. We found that the silver paste composed of 90% spherical silver powder, multi-solvent mixtures, dual-bonding resins, and 0.45% curing agent provided silver grid electrodes with both strong adhesion and low volume resistivity of 5.8 μΩ&#xa0;cm. Compared with the requirement of less than 10 μΩ&#xa0;cm for current commercial use in silicon heterojunction solar cells, the low-temperature silver paste we developed is at a good performance level.</p>

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High-Performance Low-Temperature Silver Paste Used for Silicon Heterojunction Solar Cells Through Material Selection and Formulation Optimization

  • 期刊论文

  • 发表日期：

    2025年4月18日

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  • Yiwei Dong,
  • Leihao Chen,
  • Huaming Mao,
  • Hongwei Yang

摘要

As an important material in the production of silicon heterojunction solar cells, low-temperature curing silver paste is typically used for screen printing on both surfaces of solar cells and then forms silver grid electrodes through low-temperature metallization. However, the preparation of low-temperature silver paste with excellent conductive and mechanical performance remains a challenge. This work mainly focused on the key components of low-temperature silver paste, including silver powder and organic vehicle, and investigated their effects on the rheological properties, printability, electrical conductivity, adhesion strength, and microstructural morphology. The study further explored an effective approach for the preparation of high-quality low-temperature silver paste based on the material selection and formulation optimization of both silver powder and organic vehicle. We found that the silver paste composed of 90% spherical silver powder, multi-solvent mixtures, dual-bonding resins, and 0.45% curing agent provided silver grid electrodes with both strong adhesion and low volume resistivity of 5.8 μΩ cm. Compared with the requirement of less than 10 μΩ cm for current commercial use in silicon heterojunction solar cells, the low-temperature silver paste we developed is at a good performance level.