Numerical Simulation of Waveguide Propagation Loss on Directly Bonded InP/Si Substrate

This paper explores the propagation loss in waveguides on directly bonded InP/Si substrates, using numerical simulations to understand the effect of voids within the waveguide structure. Using COMSOL Multiphysics, we developed a model to simulate light propagation, focusing on how void characteristics such as diameter and angle influence the propagation loss. Our findings reveal a correlation between void dimensions and the increased threshold current density in separate confinement heterostructure multiple quantum well laser diodes, thereby providing insights into optimizing waveguide design for enhanced laser performance on InP/Si substrates. This research underscores the critical role of substrate bonding quality in minimizing internal losses and improving device efficiency.