Research Progress on the Texture of Electrolytic Copper Foils

Electrolytic copper foils are functional basic raw material in the electronics manufacturing industry. Due to different electrolytic process conditions (such as types of additives, current density, electrodeposition time, etc.), different microstructures will be formed during the raw foil manufacturing process, such as grain size, morphology, twinning, and texture. These microstructures are closely related to the performance of the electrolytic copper foil (ECF). Texture is one key aspect among them, as it affects various properties of ECF to a certain extent, including tensile strength, elongation, and hardness. Therefore, texture is receiving increasing research attention. This article reviews recent studies on the texture of ECF, analyzes the influence of electrolytic process conditions on the formation of texture, and explores the intrinsic relationship between texture and the mechanical properties of ECF. It also provides an outlook on the mechanisms for the study of ECF texture and its future development.