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<p>In this work, effects of sintering temperature, holding time, and Ti content in the metal matrix on wear resistance of Cu–Ti/diamond composites were systematically investigated using Box-Behnken Design based on the Response Surface Methodology (RSM) for the first time. Analysis of Variance (ANOVA) identified Ti content and temperature as the dominating factors, although significant interplay between them was observed to jointly govern the formation kinetics of the interfacial TiC reaction layer. Based on the established high-precision quadratic regression model, the optimal processing parameters were determined to be 1323&#xa0;K, 30 minutes, and 45 at. pct Ti. Validation experiments yielded a weight loss of 0.997&#xa0;g under such conditions, representing a relative error of only 4.07 pct compared to the predicted value. Microstructural characterization at the interface confirmed the formation of a uniform reaction layer with a thickness of ~&#xa0;2.2&#xa0;<i>μ</i>m. The surface morphology of the optimized sample after wear showed that diamond particles predominantly exhibited transgranular fracture during the wear process, which indicates a strong metallurgical bonding has been formed at the interface, boding well to enhance the overall wear resistance of targeted Cu–Ti/diamond composites. This study establishes quantitative process-interface-property relationships for Cu–Ti/diamond composites, providing a reliable methodological reference for the synergistic optimization of properties in sintered metal-matrix diamond composites.</p>

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Optimizing Wear Resistance of Cu–Ti/Diamond Composites via the Response Surface Methodology

  • 期刊论文

  • 发表日期：

    2026年6月16日

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  • Haodong Li,
  • Yonggang Fan,
  • Xiao Zhang,
  • Cong Wang

摘要

In this work, effects of sintering temperature, holding time, and Ti content in the metal matrix on wear resistance of Cu–Ti/diamond composites were systematically investigated using Box-Behnken Design based on the Response Surface Methodology (RSM) for the first time. Analysis of Variance (ANOVA) identified Ti content and temperature as the dominating factors, although significant interplay between them was observed to jointly govern the formation kinetics of the interfacial TiC reaction layer. Based on the established high-precision quadratic regression model, the optimal processing parameters were determined to be 1323 K, 30 minutes, and 45 at. pct Ti. Validation experiments yielded a weight loss of 0.997 g under such conditions, representing a relative error of only 4.07 pct compared to the predicted value. Microstructural characterization at the interface confirmed the formation of a uniform reaction layer with a thickness of ~ 2.2 μm. The surface morphology of the optimized sample after wear showed that diamond particles predominantly exhibited transgranular fracture during the wear process, which indicates a strong metallurgical bonding has been formed at the interface, boding well to enhance the overall wear resistance of targeted Cu–Ti/diamond composites. This study establishes quantitative process-interface-property relationships for Cu–Ti/diamond composites, providing a reliable methodological reference for the synergistic optimization of properties in sintered metal-matrix diamond composites.