<p>This paper investigated the effect of Ce on the hot tearing-related properties of Al–Si eutectic liquid films between two single grains by the self-made stress–strain experimental device. The final microstructural organization and solidification process of the liquid film after deformation were also studied, thus providing theoretical guidance for reducing hot cracking susceptibility of high-silicon aluminum alloys. The results indicate that the tendency for hot cracking in the liquid film is closely related to the Ce content and temperature. The peak of the stress displacement curve of the alloy liquid film with different Ce contents varies with temperature rising in different ways. For Al–12.6 pct Si–1 pct Ce, Al–12.6 pct Si–2 pct Ce and Al–12.6 pct Si alloy liquid films, the maximum stress decreases and then increases with rising temperature; whereas for the Al–12.6 pct Si–3 pct Ce alloy liquid film, the maximum stress first increases and then decreases as the temperature rises. At the same temperature, the fracture displacement of the Al–12.6 pct Si–<i>x</i>Ce alloy liquid film increases with increasing Ce content. This phenomenon is primarily related to changes in viscosity, surface tension, and the presence of Al₂Si₂Ce and AlSiCe clusters. Additionally, we investigated the effect of thickness on the mechanical properties of the Al–12.6 pct Si–2 pct Ce alloy liquid film.</p>