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Abstract <p>Cathode residue formation during electrolytic copper powder (ECP) production substantially impacts product quality and process efficiency. This study revealed the formation mechanism of these residues and comprehensively assessed their physicochemical characteristics and effects on the production process. Cross-sectional and topographical analyses unveiled a phased deposition process resulting in ECP’s distinctive three-layer structure, which features a dense base layer firmly bonded to the copper substrate through an electroplating mechanism. This complex base layer remains as the residual structure adhered to the substrate after the outer layers of ECP are scraped off. Notably, after 30 deposition cycles, the continuous accumulation of residues on the cathode led to significant surface deterioration, characterized by a 47.7-fold increase in apparent electrochemical surface area (ECSA) and a residual layer thickness reaching 147.46&#xa0;<i>μ</i>m. These changes led to localized over-deposition and disordered copper growth, markedly impacting ECP morphology, particle size distribution, and process efficiency. To address these issues, a novel periodic reverse current technology was developed and applied. This approach effectively eliminated residue accumulation, mitigated the surge in surface roughness and ECSA, and limited the decrease in current efficiency, while curtailing the rise in energy consumption. Consequently, both the quality and efficiency of ECP production were markedly enhanced.</p> Graphical Abstract <p></p>

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Mechanism of Cathode Residue Formation in Electrolytic Copper Powder Production and Mitigation Using Periodic Reverse Current

  • 期刊论文

  • 发表日期：

    2025年2月19日

查看全文
  • Shanyu Han,
  • Yakun Yin,
  • Youpo Mise,
  • Shaohua Wang,
  • Wentang Xia,
  • Xuejiao Zhou,
  • Juan An,
  • Hongdan Wang,
  • Wenqiang Yang

摘要

Abstract

Cathode residue formation during electrolytic copper powder (ECP) production substantially impacts product quality and process efficiency. This study revealed the formation mechanism of these residues and comprehensively assessed their physicochemical characteristics and effects on the production process. Cross-sectional and topographical analyses unveiled a phased deposition process resulting in ECP’s distinctive three-layer structure, which features a dense base layer firmly bonded to the copper substrate through an electroplating mechanism. This complex base layer remains as the residual structure adhered to the substrate after the outer layers of ECP are scraped off. Notably, after 30 deposition cycles, the continuous accumulation of residues on the cathode led to significant surface deterioration, characterized by a 47.7-fold increase in apparent electrochemical surface area (ECSA) and a residual layer thickness reaching 147.46 μm. These changes led to localized over-deposition and disordered copper growth, markedly impacting ECP morphology, particle size distribution, and process efficiency. To address these issues, a novel periodic reverse current technology was developed and applied. This approach effectively eliminated residue accumulation, mitigated the surge in surface roughness and ECSA, and limited the decrease in current efficiency, while curtailing the rise in energy consumption. Consequently, both the quality and efficiency of ECP production were markedly enhanced.

Graphical Abstract