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Segregation Behavior, Microstructure Evolution and Mechanical Properties of Thixotropic Extruded CuSn10P1 Alloy

  • Hao Chen,
  • Zheng Sun,
  • Yang Tao,
  • Zhiqiang Yang,
  • Qingbiao Zhang,
  • Han Xiao

摘要

The copper alloy components are produced using the process of thixotropic extrusion and subsequently subjected to annealing at temperatures ranging from 500 °C to 600 °C for 2 hours. The liquids islands exist inside the solid phases, and the primary phases consist of α-Cu, Cu41Sn11, and Cu3P phases of thixotropic extruded copper alloy. The average grain size initially declines and subsequently increases as the annealing temperature rises. The segregation is improved, and the average grain size is fined of thixotropic extruded copper alloy by annealing at 550 °C for 2h. The impact of texture on mechanical properties can be ignored due to negligible preferred orientation is formed following annealing. The tensile strength and elongation of thixotropic extruded copper alloy are improved after annealing at 550 °C for 2h, resulting in the highest values of 449.8 MPa and 19 pct, respectively.