<p>Bifilm is a critical casting defect that significantly undermines the integrity of cast components, adversely affecting the strength, ductility, fatigue, and leak tightness. A method for enhancing the sedimentation of bifilm in the melt through the incorporation of high-density intermetallic particles and controlled cooling is introduced. The effects of two sedimentation schemes (Scheme A: adding Al–5Ti–1B at 860&#xa0;°C; Scheme B: adding Al–5Ti–1B at 800&#xa0;°C) on melt quality, grain size, and the mechanical properties of Al–Si alloys were systematically investigated. Experimental results revealed that Scheme B achieved superior grain refinement compared to Scheme A; however, Scheme A facilitated more effective bifilm sedimentation and melt purification than Scheme B. Notably reducing the settling temperature further enhanced the removal of bifilms. The adhesion of high-density (Al,Si)<sub>3</sub>Ti and <i>τ</i><sub>2</sub> phases to bifilms is identified as the primary mechanism promoting bifilm sedimentation. Compared to the non-sedimented samples, Scheme A, with a settling temperature of 630&#xa0;°C, enhanced tensile strength by 22.2 pct and elongation by 120.5 pct. The present work may provide theoretical support for developing industrially applicable methods for bifilm sedimentation.</p>

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Bifilm Sedimentation Enhanced by Al–5Ti–1B Addition in Al–Si Alloy Melt

  • Hong-Min Guo,
  • Qin-Biao Liu

摘要

Bifilm is a critical casting defect that significantly undermines the integrity of cast components, adversely affecting the strength, ductility, fatigue, and leak tightness. A method for enhancing the sedimentation of bifilm in the melt through the incorporation of high-density intermetallic particles and controlled cooling is introduced. The effects of two sedimentation schemes (Scheme A: adding Al–5Ti–1B at 860 °C; Scheme B: adding Al–5Ti–1B at 800 °C) on melt quality, grain size, and the mechanical properties of Al–Si alloys were systematically investigated. Experimental results revealed that Scheme B achieved superior grain refinement compared to Scheme A; however, Scheme A facilitated more effective bifilm sedimentation and melt purification than Scheme B. Notably reducing the settling temperature further enhanced the removal of bifilms. The adhesion of high-density (Al,Si)3Ti and τ2 phases to bifilms is identified as the primary mechanism promoting bifilm sedimentation. Compared to the non-sedimented samples, Scheme A, with a settling temperature of 630 °C, enhanced tensile strength by 22.2 pct and elongation by 120.5 pct. The present work may provide theoretical support for developing industrially applicable methods for bifilm sedimentation.