Scholarlink

<p>High-temperature plastic deformation bonding, as an advanced solid-state joining technology, achieves high-quality interfacial bonding by inducing significant plastic deformation by applying high temperature and pressure. A series of hot-compression bonding experiments were conducted on 316H austenitic stainless steel under various processing conditions to investigate the evolution of interfacial microstructure and bonding mechanisms. The effects of temperature, strain, and holding time on interfacial recrystallization and bonding behavior were established. The results indicate that dynamic recrystallization (DRX) behavior and grain boundary migration play critical roles in interfacial bonding during hot compression. Transmission electron microscopy (TEM) observations revealed that interfacial grain boundaries (IGBs) migrate toward regions with high dislocation density, providing favorable conditions for recrystallized grain nucleation. Electron Backscatter Diffraction (EBSD) analysis demonstrated that increasing temperature, enhancing strain, and appropriately extending holding time promote complete recrystallization at the interface, thereby improving bonding quality. The formation of twin boundaries further enhanced recrystallization and accelerated interface migration. Furthermore, nanoindentation tests confirmed that the mechanical properties of the interfacial region in specimens processed at 1100 °C with 0.69 true strain followed by holding treatment reach levels comparable to those of the base metal.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Microstructure Evolutions and Interfacial Bonding Mechanism of 316H Stainless Steel During High-Temperature Plastic Deformation Bonding

  • 期刊论文

  • 发表日期：

    2025年11月5日

查看全文
  • Fengming Qin,
  • Lei Wu,
  • Yajie Li,
  • Xiaodong Zhao,
  • Fei Li

摘要

High-temperature plastic deformation bonding, as an advanced solid-state joining technology, achieves high-quality interfacial bonding by inducing significant plastic deformation by applying high temperature and pressure. A series of hot-compression bonding experiments were conducted on 316H austenitic stainless steel under various processing conditions to investigate the evolution of interfacial microstructure and bonding mechanisms. The effects of temperature, strain, and holding time on interfacial recrystallization and bonding behavior were established. The results indicate that dynamic recrystallization (DRX) behavior and grain boundary migration play critical roles in interfacial bonding during hot compression. Transmission electron microscopy (TEM) observations revealed that interfacial grain boundaries (IGBs) migrate toward regions with high dislocation density, providing favorable conditions for recrystallized grain nucleation. Electron Backscatter Diffraction (EBSD) analysis demonstrated that increasing temperature, enhancing strain, and appropriately extending holding time promote complete recrystallization at the interface, thereby improving bonding quality. The formation of twin boundaries further enhanced recrystallization and accelerated interface migration. Furthermore, nanoindentation tests confirmed that the mechanical properties of the interfacial region in specimens processed at 1100 °C with 0.69 true strain followed by holding treatment reach levels comparable to those of the base metal.