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<p>Cu/Al dissimilar metal joining has received increasing attention due to the rising demand for lightweight and high-performance materials in the electronics and automotive industries. However, the formation of brittle intermetallic compounds (IMCs) during soldering severely deteriorates the mechanical and electrical properties of the joints. In this study, 1060 Al and T2 Cu were joined using ultrasonic-assisted soldering with Sn–3.0Ag–0.5Cu (SAC305) solder, which has a melting point of 217&#xa0;°C, enabling low-temperature processing. This method was employed to suppress the excessive formation of Al–Cu IMCs typically caused by high thermal input. The effects of soldering temperature (250&#xa0;°C–300&#xa0;°C) on IMC evolution, microstructure, electrical resistivity, and mechanical strength were systematically investigated. At 250&#xa0;°C and 260&#xa0;°C, the solder joints mainly consisted of Cu<sub>6</sub>Sn<sub>5</sub> and Cu<sub>3</sub>Sn, with limited Al–Cu IMCs, resulting in low resistivity and a shear strength of approximately 17.0 MPa. Increasing the soldering temperature to 280&#xa0;°C promoted the formation of AlCu, Al<sub>2</sub>Cu, and a continuous Ag<sub>2</sub>Al layer, which enhanced the shear strength to 21.5 MPa and improved fracture resistance. However, excessive growth of Al–Cu IMCs at 300&#xa0;°C raised the electrical resistivity and reduced the mechanical reliability. These results demonstrate the critical role of soldering temperature in balancing electrical and mechanical performance and provide valuable insights for optimizing Cu/Al bonding using low-temperature ultrasonic-assisted soldering.</p>

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Electrical and Mechanical Properties of Ultrasonic-Assisted Soldered Cu/Al Joints

  • 期刊论文

  • 发表日期：

    2025年7月24日

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  • Jinzhe Cui,
  • Yingzong Liu,
  • Guoxuan Xu,
  • Biwu Chen,
  • Hui Chen,
  • Yuanxing Li

摘要

Cu/Al dissimilar metal joining has received increasing attention due to the rising demand for lightweight and high-performance materials in the electronics and automotive industries. However, the formation of brittle intermetallic compounds (IMCs) during soldering severely deteriorates the mechanical and electrical properties of the joints. In this study, 1060 Al and T2 Cu were joined using ultrasonic-assisted soldering with Sn–3.0Ag–0.5Cu (SAC305) solder, which has a melting point of 217 °C, enabling low-temperature processing. This method was employed to suppress the excessive formation of Al–Cu IMCs typically caused by high thermal input. The effects of soldering temperature (250 °C–300 °C) on IMC evolution, microstructure, electrical resistivity, and mechanical strength were systematically investigated. At 250 °C and 260 °C, the solder joints mainly consisted of Cu6Sn5 and Cu3Sn, with limited Al–Cu IMCs, resulting in low resistivity and a shear strength of approximately 17.0 MPa. Increasing the soldering temperature to 280 °C promoted the formation of AlCu, Al2Cu, and a continuous Ag2Al layer, which enhanced the shear strength to 21.5 MPa and improved fracture resistance. However, excessive growth of Al–Cu IMCs at 300 °C raised the electrical resistivity and reduced the mechanical reliability. These results demonstrate the critical role of soldering temperature in balancing electrical and mechanical performance and provide valuable insights for optimizing Cu/Al bonding using low-temperature ultrasonic-assisted soldering.