Surface Damage and Microstructure Evolution of Copper-Containing Antibacterial Stainless Steel During Quasi-In Situ Tensile Process

The quasi-in situ tensile test of copper-containing antibacterial stainless steel was carried out by Shimadzu AGS-100 KN universal testing machine. The digital image correlation (DIC) was used to analyze the surface damage of different tensile strains during the tensile process of copper-containing stainless steel, and the damage equations of large deformation area and small deformation area were established. The microstructure evolution of copper-containing antibacterial stainless steel was analyzed by electron backscatter diffraction (EBSD), X-ray diffractometer (XRD), and transmission electron microscope (TEM). The experimental results show that as the strain increases, the LAGBs gradually increase, and the HAGBs and twins gradually decrease. Austenite and martensite cross each other, and some austenite are transformed into martensite. Dislocation slip affects twins, and twins continue to affect dislocation slip. The precipitation has pinning and hindering effects on dislocations and grain boundaries.