<p>Nickel as non-noble metal exhibits prominent efficiency towards electrochemical hydrogen evolution reaction, and this catalytic efficiency is further enhanced by the inclusion of rare earth elements (La, Ce, Pr, and Sm) into the nickel matrix. In this work, the electrochemical redox behavior of Ni(II) is investigated in the presence and absence of Sm(III) in choline chloride-ethylene glycol deep eutectic solvent (DES). The nucleation growth mechanism of nickel in the presence and absence of samarium is interpreted using the chronoamperometry technique. The facile electrodeposition from DES medium provides metallic Ni and Ni-Sm electrodeposits as thin coatings on copper substrate. The surface morphology and elemental characterization of Ni and Ni-Sm alloys are evaluated using physico-chemical characterization techniques such as FE-SEM, EDX, AFM, and XPS. FE-SEM and AFM analyses provide microscopic morphology and topography of as-deposited Ni and Ni-Sm samples. XPS studies revealed the oxidation states of Ni and Sm in the coatings and also confirmed the electronic interaction between Ni and Sm. EDX data confirms that Ni-Sm electrodeposits could be obtained with different samarium contents at different galvanostatic conditions. As-deposited Ni-Sm coatings on copper substrate exhibited superior hydrogen reduction catalytic efficiency than Ni electrodeposits in 1 M KOH aqueous electrolyte at room temperature.</p> Graphical abstract <p></p>

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Electrochemical deposition of nickel-samarium coatings from deep eutectic solvent for hydrogen evolution reaction

  • G. Murali Krishna,
  • C. Jeyabharathi,
  • M. Jayakumar

摘要

Nickel as non-noble metal exhibits prominent efficiency towards electrochemical hydrogen evolution reaction, and this catalytic efficiency is further enhanced by the inclusion of rare earth elements (La, Ce, Pr, and Sm) into the nickel matrix. In this work, the electrochemical redox behavior of Ni(II) is investigated in the presence and absence of Sm(III) in choline chloride-ethylene glycol deep eutectic solvent (DES). The nucleation growth mechanism of nickel in the presence and absence of samarium is interpreted using the chronoamperometry technique. The facile electrodeposition from DES medium provides metallic Ni and Ni-Sm electrodeposits as thin coatings on copper substrate. The surface morphology and elemental characterization of Ni and Ni-Sm alloys are evaluated using physico-chemical characterization techniques such as FE-SEM, EDX, AFM, and XPS. FE-SEM and AFM analyses provide microscopic morphology and topography of as-deposited Ni and Ni-Sm samples. XPS studies revealed the oxidation states of Ni and Sm in the coatings and also confirmed the electronic interaction between Ni and Sm. EDX data confirms that Ni-Sm electrodeposits could be obtained with different samarium contents at different galvanostatic conditions. As-deposited Ni-Sm coatings on copper substrate exhibited superior hydrogen reduction catalytic efficiency than Ni electrodeposits in 1 M KOH aqueous electrolyte at room temperature.

Graphical abstract