Fractal growth of copper powder on point and plate electrodes based on diffusion-limited aggregation model

When examining fractal growth issues in electrodeposited metals, analytical and control models for growth based on diffusion-limited aggregation (DLA) are frequently used. In this work, an improved DLA model was used to design a simulation program for the growth of copper dendrites deposited on point and plate electrodes. The effect of copper ion concentration on the fractal growth of copper powder dendrites was investigated. It was found that the morphology of the simulated particles in point electrodes changed from a disordered dense structure to an open dendritic structure, and the fractal dimension decreased as the binding probability increased. While in the plate electrode, the morphology changed from dense to loose, the void between the dendrite arms expanded, and the thickness of the deposited layer increased. The morphology of copper powder dendrites matched the real electrodeposition. The shape of the deposited copper was strongly influenced by the concentration of copper ions.