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<p>This paper introduces a compact 330 GHz antistatic IQ transceiver designed for high-speed wireless communication. To maximize space efficiency, the transceiver’s internal cavity is divided into two functional layers: a THz layer and an IF (intermediate frequency) layer. The THz layer is implemented on a quartz substrate and two Schottky diode-based subharmonic mixers along with a pair of compact, arch-shaped 90-degree hybrid couplers. The IF layer houses two low-noise amplifiers and an additional 90-degree hybrid coupler. The entire system operates in an IQ balanced mixer configuration, enabling effective image rejection and single-sideband (SSB) signal transmission. Experimental measurements show a best-case SSB receiver conversion loss of 8 dB at 330 GHz and image rejection exceeding 18 dB across the 305–355 GHz frequency range. Despite its advanced performance, the transceiver maintains a remarkably compact footprint of just 20 mm × 20 mm × 22 mm. A key feature of this design is its antistatic capability: the integrated chipset can withstand up to 8000 V of static discharge, providing robust protection for the sensitive Schottky diode-based components. Based on this IQ mixer, a high-speed communication experiment was successfully demonstrated, achieving a data rate of 40 Gbps using 16QAM modulation, offering a critical building block for future 6G communication technologies.</p>

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330 GHz antistatic compact vertical interconnect IQ transceiver for 6G communication

  • 期刊论文

  • 发表日期：

    2025年11月14日

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  • Zhongqian Niu,
  • Qianli Yin,
  • Bo Zhang,
  • Zhao Qi,
  • Yinian Feng,
  • Yong Fan,
  • Zhi Chen

摘要

This paper introduces a compact 330 GHz antistatic IQ transceiver designed for high-speed wireless communication. To maximize space efficiency, the transceiver’s internal cavity is divided into two functional layers: a THz layer and an IF (intermediate frequency) layer. The THz layer is implemented on a quartz substrate and two Schottky diode-based subharmonic mixers along with a pair of compact, arch-shaped 90-degree hybrid couplers. The IF layer houses two low-noise amplifiers and an additional 90-degree hybrid coupler. The entire system operates in an IQ balanced mixer configuration, enabling effective image rejection and single-sideband (SSB) signal transmission. Experimental measurements show a best-case SSB receiver conversion loss of 8 dB at 330 GHz and image rejection exceeding 18 dB across the 305–355 GHz frequency range. Despite its advanced performance, the transceiver maintains a remarkably compact footprint of just 20 mm × 20 mm × 22 mm. A key feature of this design is its antistatic capability: the integrated chipset can withstand up to 8000 V of static discharge, providing robust protection for the sensitive Schottky diode-based components. Based on this IQ mixer, a high-speed communication experiment was successfully demonstrated, achieving a data rate of 40 Gbps using 16QAM modulation, offering a critical building block for future 6G communication technologies.