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<p>Surface and interface engineering are effective methods for tailoring the properties of two-dimensional (2D) van der Waals (vdW) materials. These techniques enable fine-tuning of critical factors that dictate photoelectric conversion processes, including but not limited to carrier dynamics, built-in electric fields, and interface coupling strength. This opens up possibilities to unlock the full potential of 2D materials for developing high-speed optoelectronic devices. Such advancements are pivotal for realizing next-generation optical interconnects, which are expected to revolutionize data transmission and optical communication technologies. However, a comprehensive understanding of surface and interface engineering in 2D vdW materials for high-speed photodetection is lacking. This review endeavors to delineate the working mechanisms of these materials and provide an extensive overview of advances in engineered 2D high-speed photodetectors, with emphasis on critical aspects such as vertical channel engineering, band alignment engineering, defect engineering, hot-carrier engineering, contact engineering, and waveguide integration. The review also explores innovative strategies developed to surmount the inherent trade-off between response speed and sensitivity. Furthermore, it highlights the prevailing challenges and prospects in the realm of 2D vdW materials for high-speed photodetection.</p>

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Two-dimensional van der Waals high-speed photodetectors enhanced by surface and interface engineering

  • 期刊论文

  • 发表日期：

    2026年1月4日

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  • Yuanfang Yu,
  • Senyao Tang,
  • Linjie Yang,
  • Quan Li,
  • Fa Cao,
  • Zhenhua Ni,
  • Junpeng Lu,
  • Li Gao

摘要

Surface and interface engineering are effective methods for tailoring the properties of two-dimensional (2D) van der Waals (vdW) materials. These techniques enable fine-tuning of critical factors that dictate photoelectric conversion processes, including but not limited to carrier dynamics, built-in electric fields, and interface coupling strength. This opens up possibilities to unlock the full potential of 2D materials for developing high-speed optoelectronic devices. Such advancements are pivotal for realizing next-generation optical interconnects, which are expected to revolutionize data transmission and optical communication technologies. However, a comprehensive understanding of surface and interface engineering in 2D vdW materials for high-speed photodetection is lacking. This review endeavors to delineate the working mechanisms of these materials and provide an extensive overview of advances in engineered 2D high-speed photodetectors, with emphasis on critical aspects such as vertical channel engineering, band alignment engineering, defect engineering, hot-carrier engineering, contact engineering, and waveguide integration. The review also explores innovative strategies developed to surmount the inherent trade-off between response speed and sensitivity. Furthermore, it highlights the prevailing challenges and prospects in the realm of 2D vdW materials for high-speed photodetection.