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<p>Multilayer frequency selective surfaces (FSSs) have become core components of multi-band communication systems because they possess high selectivity, stability, and out-of-band suppression capabilities. However, interlayer reliability problems have negatively affected the manufacture of multilayer FSSs for many years, and these negative impacts are primarily reflected in restrictions in the interlayer bonding strength and the interlayer alignment accuracy. To address these problems, a macroscopic-microscopic cross-scale, multi-material integrated additive manufacturing process was designed during this study. This process, which utilizes electric field-driven (EFD) jet printing and <i>in-situ</i> curing, produced multilayer FSS structures with high-resolution patterning (with a line width of &lt; 20 µm) and a low alignment error (equal to 0.73% of the periodic dimension). A highly stable micro-interdiffused polyimide (PI) material, which was used for interlayer bonding, was developed by performing trifluoromethyl and fluorenyl side-chain modifications. This material exhibited both extreme environmental adaptability (the PI-based electrodes fabricated using this material exhibited a resistance change rate of less than 5% at 360°C) and a strong interlayer interfacial bonding strength (&gt; 3.37 MPa). Using this process and material, a dual-band FSS with passband center frequencies at 14.5 and 60 GHz was designed and fabricated. In addition, the flexibility of the PI material enabled the resultant FSSs to conform to deployable curved surfaces; thus, this material offers a simplified 2D-to-3D fabrication solution for deployable radomes. The proposed binder-free integrated forming process combines environmental sustainability with cost-effectiveness; therefore, it serves as a novel strategy for rapid manufacture and performance optimizations of high-frequency communication devices.</p>

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Integrated 3D-printed multilayer FSS with high interlayer reliability for multi-band radomes

  • 期刊论文

  • 发表日期：

    2025年9月25日

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  • Chunyu Dong,
  • Xing Liu,
  • Houchao Zhang,
  • Wenzheng Sun,
  • Tianwen Wang,
  • Juchen Li,
  • Zhenghao Li,
  • Rui Wang,
  • Hongke Li,
  • Xiaoyang Zhu,
  • Hongbo Lan

摘要

Multilayer frequency selective surfaces (FSSs) have become core components of multi-band communication systems because they possess high selectivity, stability, and out-of-band suppression capabilities. However, interlayer reliability problems have negatively affected the manufacture of multilayer FSSs for many years, and these negative impacts are primarily reflected in restrictions in the interlayer bonding strength and the interlayer alignment accuracy. To address these problems, a macroscopic-microscopic cross-scale, multi-material integrated additive manufacturing process was designed during this study. This process, which utilizes electric field-driven (EFD) jet printing and in-situ curing, produced multilayer FSS structures with high-resolution patterning (with a line width of < 20 µm) and a low alignment error (equal to 0.73% of the periodic dimension). A highly stable micro-interdiffused polyimide (PI) material, which was used for interlayer bonding, was developed by performing trifluoromethyl and fluorenyl side-chain modifications. This material exhibited both extreme environmental adaptability (the PI-based electrodes fabricated using this material exhibited a resistance change rate of less than 5% at 360°C) and a strong interlayer interfacial bonding strength (> 3.37 MPa). Using this process and material, a dual-band FSS with passband center frequencies at 14.5 and 60 GHz was designed and fabricated. In addition, the flexibility of the PI material enabled the resultant FSSs to conform to deployable curved surfaces; thus, this material offers a simplified 2D-to-3D fabrication solution for deployable radomes. The proposed binder-free integrated forming process combines environmental sustainability with cost-effectiveness; therefore, it serves as a novel strategy for rapid manufacture and performance optimizations of high-frequency communication devices.