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<p>Electrohydrodynamic (EHD) printing is a promising technique in the fabrication of high-resolution metal interconnects and fine circuit patterns. However, current approaches have restricted throughput attributed to their single-nozzle operational constraints. This study introduces a nozzle array combining dielectric glass and polymeric components, enabling direct patterning of colloidal silver into fine features via multinozzle EHD printing. Through simulation design, nozzle design guidelines applicable to high-conductivity solutions are given, and corresponding printing chips are fabricated using a microelectromechanical system process. Through parameter optimization, a high-resolution silver circuit with a line width of less than 5 µm is achieved. The resistivity is 9.45×10<sup>−8</sup> Ω m after multilayer printing, which is only 5.94 times that of pure silver. Meanwhile, printing chips with stable and high-frequency printing performance (10 kHz) facilitate dimensional modification and large-scale integration (128-nozzle). The multinozzle EHD printing process is compatible with multiple flexible/stretchable substrates, demonstrating its great potential in the commercial applications of flexible/wearable electronics and printed electronics manufacturing.</p>

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High-precision and high-efficiency arrayed electrohydrodynamic printing of fine circuits

  • 期刊论文

  • 发表日期：

    2025年8月19日

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  • Haoyu Guo,
  • Yongqing Duan,
  • Qiming Wang,
  • Juanhong Zhao,
  • Zhaoyang Sun,
  • Zhouping Yin

摘要

Electrohydrodynamic (EHD) printing is a promising technique in the fabrication of high-resolution metal interconnects and fine circuit patterns. However, current approaches have restricted throughput attributed to their single-nozzle operational constraints. This study introduces a nozzle array combining dielectric glass and polymeric components, enabling direct patterning of colloidal silver into fine features via multinozzle EHD printing. Through simulation design, nozzle design guidelines applicable to high-conductivity solutions are given, and corresponding printing chips are fabricated using a microelectromechanical system process. Through parameter optimization, a high-resolution silver circuit with a line width of less than 5 µm is achieved. The resistivity is 9.45×10−8 Ω m after multilayer printing, which is only 5.94 times that of pure silver. Meanwhile, printing chips with stable and high-frequency printing performance (10 kHz) facilitate dimensional modification and large-scale integration (128-nozzle). The multinozzle EHD printing process is compatible with multiple flexible/stretchable substrates, demonstrating its great potential in the commercial applications of flexible/wearable electronics and printed electronics manufacturing.