Scholarlink

<p>Dynamic cross-linking chemistry was employed to synthesize latent accelerators, enabling both prolonged storage stability and enhanced curing performance of one-component epoxy resins. One-component epoxy resins, like epoxy/dicyandiamide system, have gained increasing demand in various applications by virtue of their simple process and stable quality; however, they often require high curing temperatures and limited room-temperature storage life. Herein, a novel class of dynamically cross-linked latent accelerators (HUBs) based on hindered urea bond were designed and synthesized through free radical copolymerization of 1-vinylimidazole and 2-(<i>tert</i>-butylamino) ethyl methacrylate, followed by cross-linking with isophorone diisocyanate. Upon incorporation into the epoxy/dicyandiamide system, HUBs significantly lowered the curing temperature while maintaining excellent room-temperature storage stability for over 129 days, surpassing traditional imidazole-based accelerators. Moreover, the cured epoxy resins exhibited superior thermal properties, with increased glass transition temperatures reaching up to 156 °C, along with enhanced moduli and solvent resistance. This innovative strategy utilizing dynamic covalent bonds offers a promising approach for developing environmentally friendly, high-performance epoxy materials, holding significant potential in applications such as composites, high-performance coatings, electronic packaging materials, and structural adhesives.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Dynamic cross-linked latent accelerators based on hindered urea bond for one-component epoxy resins

  • 期刊论文

  • 发表日期：

    2025年8月7日

查看全文
  • Xin Wang,
  • Falin Li,
  • Changhui Jing,
  • Shuaiqi Yang,
  • Shuai Du,
  • Fengyuan Zhang,
  • Songqi Ma

摘要

Dynamic cross-linking chemistry was employed to synthesize latent accelerators, enabling both prolonged storage stability and enhanced curing performance of one-component epoxy resins. One-component epoxy resins, like epoxy/dicyandiamide system, have gained increasing demand in various applications by virtue of their simple process and stable quality; however, they often require high curing temperatures and limited room-temperature storage life. Herein, a novel class of dynamically cross-linked latent accelerators (HUBs) based on hindered urea bond were designed and synthesized through free radical copolymerization of 1-vinylimidazole and 2-(tert-butylamino) ethyl methacrylate, followed by cross-linking with isophorone diisocyanate. Upon incorporation into the epoxy/dicyandiamide system, HUBs significantly lowered the curing temperature while maintaining excellent room-temperature storage stability for over 129 days, surpassing traditional imidazole-based accelerators. Moreover, the cured epoxy resins exhibited superior thermal properties, with increased glass transition temperatures reaching up to 156 °C, along with enhanced moduli and solvent resistance. This innovative strategy utilizing dynamic covalent bonds offers a promising approach for developing environmentally friendly, high-performance epoxy materials, holding significant potential in applications such as composites, high-performance coatings, electronic packaging materials, and structural adhesives.