<p>The article uses a method for calculating thermal conductivity and thermoelasticity indices for circuit board materials with electronic radio components (ERC) mounted on them. The layout of an aircraft control system is considered, consisting of a stack of circuit boards (a laminate-rod structure) with ERCs, and a thermal model of this structure. A method is proposed for determining the maximum thermal load based on the temperature (thermal) stress measured with a certain error by solving inverse thermoelasticity problems. The maximum thermal load is determined, as well as the regulation of external and internal temperature and force loads, at which thermal stresses or thermal displacements in structural elements will be within permissible limits, which has significant theoretical importance and great practical value for thermal non-destructive testing. A reasonable approach to finding these values as functions of time and geometric coordinates is to solve inverse thermoelasticity problems. To obtain a stable solution to the inverse thermoelasticity problem, Tikhonov's method is used with an efficient search for the regularization parameter. The search for the regularization parameter is performed using an algorithm analogous to the algorithm for finding the root of a nonlinear equation. The proposed method allows one to determine the loads under which the object of study will fail without causing it to fail. Thus, the article solves inverse problems for a rectangular board with electronic radio components placed on it. The cost-effectiveness of this method lies in its ability to reduce the cost of complex experimental studies of technical objects and eliminate the need to develop computational and analytical methods that accompany them.</p>