<p>Considering the different curing temperatures (–20 and 70°C), different bonding lengths (40, 60, 80, and 120 mm), and different adhesive layer thicknesses (0.5 and 1 mm), CFRP-steel specimens were first fabricated in this article. Then, the specimens were performed on single shear tests. Meanwhile, 3D digital image correlation (DIC) technology was used to capture the strain data. Finally, the effects of curing temperatures, bonding lengths, and adhesive layer thicknesses on the interfacial bonding properties were discussed. The results indicated that the temperature environment greatly affected the interface damage mode and bond strength. At –20°C, the interface failure mode was dominated by steel-adhesive failure. At 70°C, the main failure mode was CFRP interlayer separation. Specimens with a 1 mm adhesive layer thickness, a short bond length, and low-temperature curing conditions exhibited a smaller peak load. The high-temperature curing environment improved the interfacial bonding properties, which was conducive to improving the stability of the structure and better ensured the quality effect of the construction.</p>

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Curing Temperature Environment Effect on CFRP–Steel Interface Bonding Properties

  • Y. Zhang,
  • S. S. Cheng,
  • C. Chen,
  • T. J. Tang,
  • L. Gao,
  • F. H. Ge,
  • L. Tong

摘要

Considering the different curing temperatures (–20 and 70°C), different bonding lengths (40, 60, 80, and 120 mm), and different adhesive layer thicknesses (0.5 and 1 mm), CFRP-steel specimens were first fabricated in this article. Then, the specimens were performed on single shear tests. Meanwhile, 3D digital image correlation (DIC) technology was used to capture the strain data. Finally, the effects of curing temperatures, bonding lengths, and adhesive layer thicknesses on the interfacial bonding properties were discussed. The results indicated that the temperature environment greatly affected the interface damage mode and bond strength. At –20°C, the interface failure mode was dominated by steel-adhesive failure. At 70°C, the main failure mode was CFRP interlayer separation. Specimens with a 1 mm adhesive layer thickness, a short bond length, and low-temperature curing conditions exhibited a smaller peak load. The high-temperature curing environment improved the interfacial bonding properties, which was conducive to improving the stability of the structure and better ensured the quality effect of the construction.