Study on Characterization of Hot Deformation Behavior of Pure Copper Through Dislocation Evolution Map and Power Dissipation Map

This study investigates the hot deformation behavior of pure copper through a series of compression experiments conducted using a Gleeble 1500 thermo-mechanical simulator, with temperatures ranging from 500°C to 900°C and strain rates (SR) varying between 0.001 and 1 s^–1. Dislocation density (DD) was used as an internal state variable to analyze the dynamic recrystallization (DRX), dynamic recovery (DRV), and secondary work hardening (SWH) behaviors. It was found that the strain-rate sensitivity coefficients for critical and steady-state conditions remain constant, approximately 1/6. Dislocation evolution maps (DEM), power dissipation maps (PDM), and metallographic analyses were used to elucidate the effects of deformation parameters on DRX and DRV processes. Optimal processability and desirable microstructures were achieved at low SRs and moderate temperatures.