<p>We present the results of studying the thermal effects produced by a backward-wave oscillator signal at a frequency of 1.0–1.1 THz on a mixing element based on an Nb–AlN–NbN superconductor–insulator–superconductor (SIS) tunnel junction included in a NbTiN–SiO<sub>2</sub>–Al microstrip transmission line. The developed receiving system consists of a slot antenna, matched microstrip transmission lines, and two SIS mixers with junction areas of about 1 μm<sup>2</sup>. Under exposure to a signal at a frequency around 1 THz, a significant change in the current–voltage characteristic of the SIS junctions was observed, which manifested as a decrease in the gap voltage and indicated heating of the mixing element, significantly affecting the characteristics of the receiving system. An analytical model describing the studied structure exposed to a high-frequency signal is proposed. The mechanisms leading to direct heating of the tunnel junction and to a change in the distribution function of quasiparticles in the electrode material are analyzed. The relevant effects are identified and their influence on the heating of the junction and, as a result, on the decrease in the gap voltage is numerically estimated. The total heat generation budget and the spatial temperature distribution in the integrated circuit are calculated.</p>

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Heating of a Superconductor–Insulator–Superconductor Mixer Under Exposure to External Terahertz Radiation

  • N. V. Kinev,
  • F. V. Khan,
  • A. M. Chekushkin,
  • V. P. Koshelets

摘要

We present the results of studying the thermal effects produced by a backward-wave oscillator signal at a frequency of 1.0–1.1 THz on a mixing element based on an Nb–AlN–NbN superconductor–insulator–superconductor (SIS) tunnel junction included in a NbTiN–SiO2–Al microstrip transmission line. The developed receiving system consists of a slot antenna, matched microstrip transmission lines, and two SIS mixers with junction areas of about 1 μm2. Under exposure to a signal at a frequency around 1 THz, a significant change in the current–voltage characteristic of the SIS junctions was observed, which manifested as a decrease in the gap voltage and indicated heating of the mixing element, significantly affecting the characteristics of the receiving system. An analytical model describing the studied structure exposed to a high-frequency signal is proposed. The mechanisms leading to direct heating of the tunnel junction and to a change in the distribution function of quasiparticles in the electrode material are analyzed. The relevant effects are identified and their influence on the heating of the junction and, as a result, on the decrease in the gap voltage is numerically estimated. The total heat generation budget and the spatial temperature distribution in the integrated circuit are calculated.