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<p>Copper nanoparticles, owing to their distinctive physical and chemical properties—including high electrical conductivity, surface plasmon resonance, and antimicrobial activity—are gaining increasing prominence across modern scientific and technological domains. This article presents a novel application of the additive laser-induced forward transfer (LIFT) technique for the in situ generation and site-specific deposition of copper nanoparticles, tailored for localized integration into microelectronic architectures. Through optimization of nanosecond LIFT processing parameters, we demonstrate a single-step, non-contact, and high-throughput fabrication route for direct printing of copper-based conductive tracks and circuit elements, achieving a high specific conductivity of ≈ 33 kS/cm—among the highest reported for laser-printed copper without post-deposition sintering. This approach offers a scalable, maskless alternative for next-generation flexible and printed electronics, combining precision, material efficiency, and compatibility with thermally sensitive substrates.</p>

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In situ production of copper nanoparticles by laser-induced forward transfer: prospects for application in microelectronics

  • 期刊论文

  • 发表日期：

    2025年11月10日

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  • Alena Nastulyavichus,
  • Nikita Smirnov,
  • Evgenia Ulturgasheva,
  • Irina Dzhun,
  • Nikolay Pokryshkin,
  • Sofia Babina,
  • Sergey Kudryashov

摘要

Copper nanoparticles, owing to their distinctive physical and chemical properties—including high electrical conductivity, surface plasmon resonance, and antimicrobial activity—are gaining increasing prominence across modern scientific and technological domains. This article presents a novel application of the additive laser-induced forward transfer (LIFT) technique for the in situ generation and site-specific deposition of copper nanoparticles, tailored for localized integration into microelectronic architectures. Through optimization of nanosecond LIFT processing parameters, we demonstrate a single-step, non-contact, and high-throughput fabrication route for direct printing of copper-based conductive tracks and circuit elements, achieving a high specific conductivity of ≈ 33 kS/cm—among the highest reported for laser-printed copper without post-deposition sintering. This approach offers a scalable, maskless alternative for next-generation flexible and printed electronics, combining precision, material efficiency, and compatibility with thermally sensitive substrates.