NES-EBVIS: an enhanced broadband vibration isolation system with a nonlinear energy sink absorber
摘要
Existing nonlinear energy sink (NES) faces challenges in vibration isolation applications, including a narrow vibration suppression bandwidth, suboptimal energy collection efficiency, and poor stiffness adjustment accuracy. A more efficient broadband vibration isolation solution is urgently required. This paper proposes a novel nonlinear vibration mechanism based on magneto-mechanical-piezoelectric coupling on which basis we design NES-EBVIS. By integrating the nonlinear stiffness characteristics of the magnetic levitation mechanism, the high-precision adjustment capabilities of the mechanical structure, and the high energy density of piezoelectric materials, this design aims to achieve the dual goals of broadband and high-efficiency vibration isolation. First, this paper introduces a combined model of axial and radial magnetization in magnetic rings via magnetic levitation technology and presents a novel magnetoelectric NES with a positive-negative stiffness parallel structure. This design fully leverages the principles of magnetic characteristics and precise adjustment mechanisms, significantly broadening the frequency response range. Secondly, NES-EBVIS takes advantage of the high energy density of piezoelectric stacking, responding rapidly to vibration disturbances, converting them into electrical energy, and adjusting stiffness through charge accumulation, thereby further enhancing the system’s nonlinear stiffness adjustment capabilities. The model was solved using a high-order harmonic balance algorithm, with results showing that NES-EBVIS can achieve exceptionally high vibration energy absorption rates across an enhanced bandwidth frequency range. The system demonstrates not only robust stability and anti-interference capabilities but also achieves efficient energy absorption with minimal parameter configuration, offering significant potential for widespread application in the fields of ultra-precision machining and microelectronics manufacturing.